Allicdata Part #: | ATS-08F-10-C3-R0-ND |
Manufacturer Part#: |
ATS-08F-10-C3-R0 |
Price: | $ 3.93 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 45X45X25MM XCUT T412 |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ATS-08F-10-C3-R0 Datasheet/PDF |
Quantity: | 1000 |
10 +: | $ 3.57399 |
30 +: | $ 3.37554 |
50 +: | $ 3.17696 |
100 +: | $ 2.97845 |
250 +: | $ 2.77989 |
500 +: | $ 2.58133 |
1000 +: | $ 2.53168 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 1.772" (45.00mm) |
Width: | 1.772" (45.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.984" (25.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 7.99°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
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When it comes to thermal management, heat sinking is a common way to increase a system\'s overall efficiency. The ATS-08F-10-C3-R0 heat sink is a quality model that offers improved thermal transfer capability and durability. In this article, we will discuss the application field and working principle of the ATS-08F-10-C3-R0 heat sink.
ATS-08F-10-C3-R0 Heat Sink Applications
The ATS-08F-10-C3-R0 heat sink is designed for high-performance cooling applications. It can be used in applications where radiation is a significant factor. This is due to its exceptional ability to dissipate large amounts of heat from the surface of the device. This is possible due to the large fin area, which allows for maximum heat transfer. It is also suitable for high-temperature systems where maximum cooling performance is essential.
The ATS-08F-10-C3-R0 heat sink is ideal for applications that require high-frequency devices, such as power supplies, power amplifiers, switching power supplies, and voltage regulators. This model is also often used in LED lighting applications, phase-locked loops, and pulse-width modulation circuits.
In addition to its cooling performance, the ATS-08F-10-C3-R0 heat sink boasts a sleek and attractive design that allows it to blend in with most electronic components. The heat sink has an elegant aluminum finish and is well-ventilated, making it suitable for various types of applications.
ATS-08F-10-C3-R0 Heat Sink Working Principle
Heat is transferred from internal sources, such as electric components, into the atmosphere by means of convection. The ATS-08F-10-C3-R0 heat sink features a highly efficient extruded heatsink structure, which increases the exchange of heat between the component and the surrounding environment. The extruded structure is made up of two layers, with the top layer comprising either a perforated sheet with multiple holes or an extruded mesh. The bottom layer is usually composed of a fin or louvered design.
The heat generated by the mounting of a component is dissipated from its surface into the atmosphere via the heat sink. The fins reduce the heat transfer coefficient, which increases the surface area and increases air flow, thereby allowing for a quicker dissipation of the heat. The internal design of the ATS-08F-10-C3-R0 heat sink ensures that it has a low air-side pressure drop, thereby maximizing airflow and allowing for effective cooling.
Conclusion
The ATS-08F-10-C3-R0 heat sink is a reliable and reliable model designed for high-performance thermal transfer applications. Its impressive efficiency and design make it a great choice for a variety of uses. The ATS-08F-10-C3-R0 is perfect for cooling high-frequency components, LED lighting, and voltage regulation applications. Its working principle is based on a highly efficient extruded heat sink structure, wherein the heat generated is dissipated effectively into the atmosphere.
The specific data is subject to PDF, and the above content is for reference