ATS-08F-110-C1-R1 Allicdata Electronics
Allicdata Part #:

ATS-08F-110-C1-R1-ND

Manufacturer Part#:

ATS-08F-110-C1-R1

Price: $ 4.60
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 54X40X12.7MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-08F-110-C1-R1 datasheetATS-08F-110-C1-R1 Datasheet/PDF
Quantity: 1000
10 +: $ 4.14099
30 +: $ 3.91083
50 +: $ 3.68084
100 +: $ 3.45076
250 +: $ 3.22071
500 +: $ 2.99066
1000 +: $ 2.93315
Stock 1000Can Ship Immediately
$ 4.6
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Rectangular, Fins
Length: 2.126" (54.01mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.500" (12.70mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 26.97°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is a critical consideration when designing and assembling electrical and electronic equipment. Without proper thermal management, electronic components and assemblies can become too hot with the potential to cause performance issues or catastrophic failure. ATS-08F-110-C1-R1 is a thermal management solution aimed at providing effective cooling for a variety of applications.

The ATS-08F-110-C1-R1 is a thermal management solution based on a heat sink. The heat sink is a metal plate that transfers heat away from components or assemblies by radiation and convection. The heat sink has a high thermal conductivity and is designed with channels or fins to increase the surface area, which helps to dissipate more heat.

The ATS-08F-110-C1-R1 can be used in a variety of applications. It is suitable for cooling components such as IGBTs, motors, and power semiconductors. It can also be used for high-performance phase-change thermal management solutions. The ATS-08F-110-C1-R1 can also be used for LED lighting and other applications that require efficient thermal management.

The ATS-08F-110-C1-R1 is also designed with several features that provide added convenience for thermal management. The design of the heat sink includes an integrated fan that helps to increase the cooling effect, as well as a mounting bracket to facilitate easy installation. The design also includes an adjustable airflow direction, which allows the user to direct cooling to areas where it is most needed. The fan also features an automatic speed control feature, which allows it to adjust its speed based on the temperature of the heat sink.

The ATS-08F-110-C1-R1 is also designed with a range of unique features that make it suitable for a variety of applications. It is designed to be water resistant, and the heat sink is IP67-rated, meaning it can be used in wet environments. The heat sink also features a protective coating which helps to prevent corrosion and oxidation. It is also designed with thermal-cycle protection, which helps to prevent damage due to temperature changes.

The ATS-08F-110-C1-R1 is an efficient thermal management solution that offers effective performance and a wide range of uses. The heat sink is designed with superior thermal conductivity and features a range of features to provide added convenience. Its IP67-rating and protective coating also make it suitable for use in a variety of wet or corrosive environments. Finally, the adjustable airflow direction and automatic fan speed control make it an ideal solution for applications that require efficient thermal management.

The specific data is subject to PDF, and the above content is for reference

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