| Allicdata Part #: | ATS-08F-145-C1-R0-ND |
| Manufacturer Part#: |
ATS-08F-145-C1-R0 |
| Price: | $ 3.60 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X30MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-08F-145-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.26907 |
| 30 +: | $ 3.18087 |
| 50 +: | $ 3.00422 |
| 100 +: | $ 2.82744 |
| 250 +: | $ 2.65074 |
| 500 +: | $ 2.56237 |
| 1000 +: | $ 2.29730 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.68°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is important for effective operation of today\'s electronic components and systems. The right choice of heat sink is an integral part of a successful thermal design.
The ATS-08F-145-C1-R0 heat sink is a thermal solution designed to help dissipate heat from electronic components and systems. It is an ideal solution when an efficient thermal solution is needed in a compact space. The ATS-08F-145-C1-R0, as part of thermal management is suitable for a variety of applications from low power electronics to high power HVAC systems.
The ATS-08F-145-C1-R0 heat sink is a lightweight aluminum fin structure with intermittent fins and air gap to achieve increased thermal performance in a small form factor. The heat sink is composed of several aluminum fins set in an alternating pattern so as to maximize surface area and provide optimal thermal conductivity. The air gap between the fins is designed to reduce resistance to airflow and increase thermal efficiency. The ATS-08F-145-C1-R0 heat sink comes with four option (A, B, C1 and R0) to choose from with different fin thickness , fin depth and air gap sizes.
The ATS-08F-145-C1-R0 heat sink is designed to be used with medium-to-high powered consumer electronics and HVAC systems. It is typically used in applications such as chipsets, CPUs, GPUs, and other high-performance electronic systems. The heat sink is also well suited for applications that require thermal insulation and heat dissipation, such as displays, cameras, and other high power components. The heat sink can also be used as a mounting device for direct contact components in order to reduce the number of components and maximize the thermal efficiency of the thermal design.
When installed, the ATS-08F-145-C1-R0 heat sink works by dissipating heat away from the components or systems. The air gap between the fins helps to increase air flow which increases the convection of heat away from the heat source. This helps to reduce the temperature of the system and helps to maintain a steady and efficient temperature for the components and the operating environment. Additionally, the aluminum fins help to dissipate the heat to a larger surface area in order to better spread the heat to other components and environment. This helps to keep the heat away from concentrated areas making it easier to dissipate.
The ATS-08F-145-C1-R0 heat sink is a great choice for those looking for an efficient, compact, and lightweight thermal solution for their electronic components and systems. With a variety of fin sizes and air gap spacing, the heat sink is designed to provide maximum thermal performance in a small form factor. The heat sink is ideal for those needing a thermal solution for medium to high-powered electronics and HVAC systems.
The specific data is subject to PDF, and the above content is for reference