ATS-08F-166-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-08F-166-C3-R0-ND

Manufacturer Part#:

ATS-08F-166-C3-R0

Price: $ 3.27
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 25X25X15MM R-TAB T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-08F-166-C3-R0 datasheetATS-08F-166-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 2.97234
30 +: $ 2.89170
50 +: $ 2.73105
100 +: $ 2.57040
250 +: $ 2.40975
500 +: $ 2.32942
1000 +: $ 2.08845
Stock 1000Can Ship Immediately
$ 3.27
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 0.984" (25.00mm)
Width: 0.984" (25.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.590" (15.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 12.46°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat sinks are essential components in any electronic setup. They help keep components from overheating during normal operation, and they help maintain consistent temperatures during extended periods of use. The ATS-08F-166-C3-R0 is a heat sink designed to support applications that require reliable heat dissipation. In this article, we discuss the application field and working principle of the ATS-08F-166-C3-R0.

Application Field

The ATS-08F-166-C3-R0 heat sink is designed to be used for cooling components in any electronic system. It is suitable for use in devices with a high power density such as power supplies, CPUs, video cards, low-noise amplifiers, and servers. The ATS-08F-166-C3-R0 is able to reliably withstand temperatures up to 120°C while dissipating high amounts of heat generated by the components it is cooling.

The heat sink also offers a wide range of applications in industrial, automotive, and military areas. The heat sink is able to dissipate large amounts of heat in environments that would normally require specialized components. The heat sink is ideal for heavy-duty devices such as heavy machinery, medical equipment, or military equipment. The heat sink is also suitable for systems that require precise temperature regulation and are located in harsh environments.

Working Principle

The ATS-08F-166-C3-R0 is a metallic, conduction-type heat sink. This means the heat created by the electronic components is conducted to the heat sink where it is dissipated through conduction. The heat from the components is conducted to the fins of the heat sink via the base material. The fins of the heat sink are designed to enhance the transfer of heat and maximize the spread of the heat through the fins. The heat is then transfered to the surrounding air. The airflow around the heat sink helps to dissipate the heat.

The ATS-08F-166-C3-R0 is designed to provide effective heat dissipation with minimal noise. The noise level generated by the heat sink is minimal due to the design of the fins and the size of the fins. The fins are designed to reduce the turbulence created by the air flow, thus reducing noise. As a result, the ATS-08F-166-C3-R0 is suitable for applications in which noise is a major concern.

In conclusion, the ATS-08F-166-C3-R0 is a heat sink designed for applications that require reliable heat dissipation. The heat sink is able to dissipate large amounts of heat generated by components in a variety of environments while maintaining a consistent temperature and low-noise operation. The heat sink is also suitable for industrial, military, and automotive applications.

The specific data is subject to PDF, and the above content is for reference

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