Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.181" (30.00mm)
Width:	1.181" (30.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.590" (15.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	10.26°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Thermal - Heat Sinks: ATS-08F-170-C3-R0 Application Field and Working Principle

Thermal - Heat Sinks are devices used to dissipate and transfer heat away from sensitive components. The ATS-08F-170-C3-R0 are a variant used to dissipate and transfer heat away from electrical and electronic components. These devices are usually made from aluminum or copper and provide superior performance than traditional heatsink solutions. The purpose of this article is to explain the application field and working principle of the ATS-08F-170-C3-R0.The ATS-08F-170-C3-R0 is designed to dissipate heat from electrical and electronic components at a higher efficiency. These devices consist of an extruded aluminum body constructed with a central channel and multiple fins. This design provides a good amount of surface area for the transfer of heat away from the component. The device can be affixed to the component in one of two ways: through the use of screws or by soldering.The application field of the ATS-08F-170-C3-R0 covers various electrical devices such as power transistors, rectifiers, LEDs, and other high current components. It can also be used to dissipate heat from electric motors, batteries, and batteries in vehicles. In addition to this, the ATS-08F-170-C3-R0 can also be used in the aerospace and automotive industry.When it comes to the working principle of the ATS-08F-170-C3-R0, it is quite simple. The aluminum or copper of which it is made of acts as a conductor of heat away from the component. As the component begins to heat up, heat is transferred away from it and into the air around it through the aluminum or copper fins and channel. This in turn helps to reduce the temperature of the component and protect it from overheating.Overall, the ATS-08F-170-C3-R0 is an excellent solution for the thermal management of electrical and electronic components. It offers superior performance than traditional heatsink solutions and can be easily affixed to the component it is being used on. Furthermore, its application field is quite broad and can be used in various industries such as aerospace and automotive. Finally, its simple working principle of dissipating and transferring heat away from the component ensures that it provides excellent protection from overheating and damage.

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