| Allicdata Part #: | ATS14807-ND |
| Manufacturer Part#: |
ATS-08F-171-C2-R0 |
| Price: | $ 3.91 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X20MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-08F-171-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.55320 |
| 10 +: | $ 3.45933 |
| 25 +: | $ 3.36596 |
| 50 +: | $ 3.17898 |
| 100 +: | $ 2.99193 |
| 250 +: | $ 2.80496 |
| 500 +: | $ 2.71146 |
| 1000 +: | $ 2.43095 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.33°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is critical to the successful operation of many electronic devices. Heat sinks, which are surface-mounted to a device, dissipate heat away from this component, thus helping it to run more efficiently. The ATS-08F-171-C2-R0 is a specific type of heat sink, designed for a variety of applications. This article will discuss the ATS-08F-171-C2-R0\'s application field and working principle.
The ATS-08F-171-C2-R0 can be used for a variety of applications, including: automotive electronics, power supplies, high-frequency circuits, displays, telecommunications equipment, consumer electronics, and medical instrumentation. In most applications, it is used to dissipate heat away from the component it is attached to. This helps to maintain the desired operating temperature of the device, allowing it to function properly.
The ATS-08F-171-C2-R0 is designed with highly efficient heat dissipation features. It features a large fin area for high thermal performance, and its fin profiles have optimized surface area for maximum effectiveness. Its design also includes a full range of accessories, including clip carriers, mounting screws, and plastic rivets, for easy installation. The ATS-08F-171-C2-R0 has an operating temperature range of -60°C to +150°C, making it suitable for a variety of applications.
The working principle of the ATS-08F-171-C2-R0 is based on the process of thermoelectric cooling. This process involves creating an electric field between two conductors, which causes heat to flow from one conductor to the other. In this particular heat sink, the electric field is created between the mounting plane of the component and the fins of the heat sink. As heat flows from the component to the fins, it is dissipated away from the device, thus helping it to maintain its desired temperature.
In addition to its excellent thermoelectric cooling capabilities, the ATS-08F-171-C2-R0 also offers excellent EMI and RFI shielding. This helps to reduce interference from other electronic components, allowing them to operate at optimum efficiency. The heat sink\'s robust construction also ensures that it can withstand temperatures up to +150°C, making it suitable for a wide range of applications.
The ATS-08F-171-C2-R0 is a versatile heat sink designed for a variety of applications. It features highly efficient thermoelectric cooling, plus excellent EMI and RFI shielding. Its operating temperature range of -60°C to +150°C makes it suitable for use in many applications, including automotive electronics, power supplies, high-frequency circuits, displays, telecommunications equipment, consumer electronics, and medical instrumentation. The ATS-08F-171-C2-R0 is a reliable and efficient heat sink that can help ensure the successful operation of many electronic devices.
The specific data is subject to PDF, and the above content is for reference