| Allicdata Part #: | ATS-08F-173-C1-R0-ND |
| Manufacturer Part#: |
ATS-08F-173-C1-R0 |
| Price: | $ 3.60 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X30MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-08F-173-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.26907 |
| 30 +: | $ 3.18087 |
| 50 +: | $ 3.00422 |
| 100 +: | $ 2.82744 |
| 250 +: | $ 2.65074 |
| 500 +: | $ 2.56237 |
| 1000 +: | $ 2.29730 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.68°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are essential components in any system that requires effective thermal management. Whether it’s to protect sensitive electronic components from overheating or to ensure the correct operating temperature of a processor, heat sinks provide an effective and reliable solution.
The ATS-08F-173-C1-R0 is one of the most popular and dependable series of heat sinks on the market today. This heat sink features an aluminum housing and constructed with regard to IEC 60 570-1 and IEC 60 570-2 overall safety standards, and has been extensively used in all kinds of electronics devices such as circuit boards, telecommunications applications and more.
The device is built with an outer casing, made from composite aluminum material, allowing for excellent thermal performance. It contains a base with twenty-five aluminum fins, and the fins feature a special electrostatically applied chill-black coating so as to efficiently absorb and transfer heat generated from the device it’s cooling. The base and fins can be designed and manufactured to specific customer requirements, allowing for unique shapes, sizes, and dimensions, subject to certain constraints with regard to overall size and thermal load capability.
The ATS-08F-173-C1-R0 is highly efficient as a cooling device due to its high thermal conductivity and ability to dissipate heat quickly and safely without building up excess heat in the device being cooled. It has been tested extensively according to military standards and is capable of up to 150° C temperature operation. The device is incredibly durable and has proven to be an important component in the fabrication and deployment of high performance electronics.
The ATS-08F-173-C1-R0 has a low profile, allowing for easy and unobtrusive installation in tight spaces, and comes with a choice of different mounting options for maximum versatility. Moreover, it is easily adaptable to rapid thermal response and low resistance applications, and has a wide range of voltage ratings making it suitable for a wide variety of projects.
The ATS-08F-173-C1-R0 is part of a range of thermal-heat sinks available for customers looking for reliable, efficient and durable thermal management solutions. The device has a range of advantages and benefits that make it an ideal choice for a wide variety of applications. From industrial electronics and communication systems, to medical electronics, the device is an important component in helping to keep devices running at peak performance and reliability.
The specific data is subject to PDF, and the above content is for reference