ATS-08F-20-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	2.126" (54.01mm)
Width:	2.126" (54.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	7.21°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Overview of ATS-08F-20-C3-R0:
The ATS-08F-20-C3-R0 is a thermal-heat sink designed for contact cooling applications. It consists of a twisted fin-type heat sink, optimized to provide high cooling performance with low pressure drop. Additionally, the heat sink features a high thermal conductivity base plate which enables efficient heat dissipation. The ATS-08F-20-C3-R0 is an ideal choice for applications requiring a high thermal performance in a confined space.

Application Field:
The ATS-08F-20-C3-R0 is especially suitable for contact cooling of components in a variety of applications. For instance, it can be used to cool high-power, high-temperature electronic components such as LED drivers, transistors, MOSFETs, and other power electronic components. Its high performance also makes it suitable for cooling processors, graphics cards, and memory modules in computer systems. Furthermore, it can be used to cool power electronics or other high-temperature, high-power applications in industrial environments, as well as in military applications.

Working Principle:
The ATS-08F-20-C3-R0 features a unique twisted fin-type contact thermal-heat sink, which optimizes cooling performance while keeping the pressure drop low. The heat sink consists of a flat aluminum base plate with a large number of fins extending from it. This base plate has a high thermal conductivity and efficiently transfers heat from the components to the heat sink. The fins then disperse the heat, which is later taken away by the surrounding air. This combined thermal-mechanical structure ensures maximum thermal performance with minimal pressure drop.

In addition, the ATS-08F-20-C3-R0 heat sink features an innovative spring-loaded mounting mechanism. This enables the heat sink to be held firmly in place and prevents it from vibrating or moving when subjected to sudden changes in temperature or shock. The mechanism also ensures that a secure contact is maintained between the heat sink and the thermal component, maximizing heat transfer and cooling efficiency.

Conclusion:
In conclusion, the ATS-08F-20-C3-R0 heat sink is an ideal choice for a wide range of contact cooling applications. Its innovative design and high thermal performance provide maximum cooling efficiency in even the most demanding situations. Furthermore, its spring-loaded mounting mechanism enables secure installation and ensures optimal heat transfer. This makes it a perfect solution for applications ranging from LED drivers and power electronic components to computer system cooling and military applications.

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