| Allicdata Part #: | ATS-08F-22-C3-R0-ND |
| Manufacturer Part#: |
ATS-08F-22-C3-R0 |
| Price: | $ 5.12 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X12.7MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: | ATS-08F-22-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.60341 |
| 30 +: | $ 4.34784 |
| 50 +: | $ 4.09210 |
| 100 +: | $ 3.83632 |
| 250 +: | $ 3.58057 |
| 500 +: | $ 3.32481 |
| 1000 +: | $ 3.26087 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 13.88°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Heat sinks are essential components used in the cooling of electronic devices. They are designed to help dissipate heat generated by electronics components such as integrated circuits, CPUs, and other electronic components. The ATS-08F-22-C3-R0 is a highly effective and efficient heat sink used to dissipate heat in many applications.
The ATS-08F-22-C3-R0 is a thermal heat sink manufactured by ATS Advanced Thermal Solutions. This passive cooling solution is comprised of an extruded aluminum base with air fin heat sinks and copper heat pipes. This components works by drawing heat away from the heat generating element and then dissipating it through convection and conduction. The copper pipes help to conduct heat from the heat source to the aluminum fins.
Due to its efficient design, the ATS-08F-22-C3-R0 is an ideal solution for applications that generate large amounts of heat. This heat sink can dissipate up to 80 Watts in applications such as telecom, computer, medical, industrial, and automotive systems. It is also suitable for semi-conductors, such as CPUs and GPUs, as they tend to generate extraordinary amounts of heat. Furthermore, this heat sink provides maximum cooling effect while consuming minimum energy.
The ATS-08F-22-C3-R0 is an easy to install heat sink and comes with a clip-on mounting bracket for secure attachment to the surface of the heat generating element. It features an oversized base with optimized air channels which allows for efficient heat dissipation. Additionally, the heat sink has a machined rectangular notch in the center for easy installation in cramped spaces.
The ATS-08F-22-C3-R0 has an operating temperature range between -20 to 80°C and is rated for a noise level from 15 to 25 dB(A). The air side pressure drop of this heat sink is 12.5 mmH2O at a maximum air velocity of 32 m/s. Additionally, it can handle air flow ranges from 30 to 50 CFM.
The ATS-08F-22-C3-R0 is a highly effective and reliable solution for thermal management in many applications. It provides maximum cooling with minimum energy consumption, which makes it an ideal solution for applications requiring efficient heat dissipation.
The specific data is subject to PDF, and the above content is for reference
ATS-08F-22-C3-R0 Datasheet/PDF