| Allicdata Part #: | ATS-08F-38-C2-R0-ND |
| Manufacturer Part#: |
ATS-08F-38-C2-R0 |
| Price: | $ 6.15 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 36.83X57.6X22.86MM T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-08F-38-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.52888 |
| 30 +: | $ 5.22186 |
| 50 +: | $ 4.91463 |
| 100 +: | $ 4.60744 |
| 250 +: | $ 4.30028 |
| 500 +: | $ 3.99312 |
| 1000 +: | $ 3.91632 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 1.450" (36.83mm) |
| Width: | 2.267" (57.60mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.900" (22.86mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.42°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management has long been an issue for consumer goods and industrial equipment. The use of passive cooling methods such as heat sinks can reduce the complexity and cost of cooling systems, and increase the lifespan of electrical and electronic components. The ATS-08F-38-C2-R0 is an example of a passively cooled heat sink. It is designed to provide efficient heat dissipation in a variety of applications.
The ATS-08F-38-C2-R0 heat sink features a double dip-coated aluminum base plate and is designed for air-cooled operation. It has a total width of just 8mm and a height of 38mm. The device features a total heat dissipation area of 8.5 cm squared and provides a maximum air flow of 78 cubic feet per minute (CFM) at an airflow speed of 55 000 RPM. The device comes with pre-installed PWM fan adapters for convenient connection of fans.
The design of the ATS-08F-38-C2-R0 heat sink is optimized for maximum cooling efficiency. The heat sink has a square-shaped base and a unique fin design that increases the surface area available for heat dissipation. The heat sink also features an asymmetric fin pattern that helps to ensure an even distribution of air flow across the entire surface area. This helps to reduce the thermal resistance and minimize the amount of heat that is trapped in the fins.
The ATS-08F-38-C2-R0 heat sink is suitable for use in a variety of applications. It is particularly well-suited for applications where high-efficiency heat dissipation is required, such as LED lighting, processor cooling, power conversion, and telecommunication modules. It can also be used in solar modules, automotive electronics, and consumer electronics. The device is also certifiably suitable for use in industrial and commercial environments.
The ATS-08F-38-C2-R0 heat sink is designed to work using the principle of convection. Heat is dissipated from the source by circulating air across the fins of the heat sink. The air flow is generated by the thermal resistance of the device as well as the fan adapters. As the air passes through the heat sink, the heat is transferred from the hot components to the colder air outside the device. This process occurs until the air and all the components are at the same temperature, at which point the heat sink reaches equilibrium and the cooling cycle is complete.
The ATS-08F-38-C2-R0 heat sink offers a reliable and cost-effective solution for thermal management in a variety of applications. It is designed with a high level of efficiency and a unique fin pattern that helps to ensure even temperature distribution. The device also features pre-installed fan adapters for easy connection to various internal components. Together, these features make the ATS-08F-38-C2-R0 heat sink an ideal solution for thermally managed applications.
The specific data is subject to PDF, and the above content is for reference