ATS-08F-42-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-08F-42-C1-R0-ND

Manufacturer Part#:

ATS-08F-42-C1-R0

Price: $ 6.48
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 57.9X60.96X22.86MM
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-08F-42-C1-R0 datasheetATS-08F-42-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 5.82939
30 +: $ 5.50578
50 +: $ 5.18188
100 +: $ 4.85806
250 +: $ 4.53419
500 +: $ 4.21032
1000 +: $ 4.12935
Stock 1000Can Ship Immediately
$ 6.48
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Rectangular, Fins
Length: 2.280" (57.90mm)
Width: 2.400" (60.96mm)
Diameter: --
Height Off Base (Height of Fin): 0.900" (22.86mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.30°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management has been a critical element of the design and implementation of electronic applications for years. As the semiconductor industry continues to advance at a rapid pace, the need for effective cooling solutions is increasing, and the thermal and heat sink industry is responding with more efficient cooling systems. Among the most popular and efficient cooling systems is the Thermal Solutions ATS-08F-42-C1-R0.

This unit is a two-channel enhanced heat-sink and fan module designed for today’s demanding thermal and power management requirements. It is constructed from a combination of high-performance extruded aluminum and high-grade stainless steel materials, ensuring maximum thermal efficiency and long-term durability. This module is designed for use in a wide range of applications, including high-end desktop computers, notebook computers, and other computing and storage devices that require superior cooling.

The ATS-08F-42-C1-R0 is equipped with two advanced heat exchanger fans that are capable of providing excellent airflow, allowing for an optimal temperature range within the system. It also features a four-channel heat pipe design that provides superior heat conduction, helping to ensure the highest efficiency possible. These fans run at an impressive 3000 RPM, providing cool temperatures for both the CPU and the surrounding environment. The design of the ATS-08F-42-C1-R0 also allows for its easy integration into a wide variety of systems and architectures.

The ATS-08F-42-C1-R0 is capable of providing effective cooling solutions for a wide variety of applications. This includes high-end desktop and laptop computers, servers, gaming consoles, and other high-end computing and storage applications. This module is ideal for applications that require superior thermal management and power management capabilities. It can also be used in a variety of industrial and commercial applications where cooling needs are not as stringent as in a typical consumer product.

The ATS-08F-42-C1-R0 is designed to be a highly efficient, yet cost-effective solution for thermal management. It is capable of providing cooling to a wide range of systems, while keeping the overall cost of the solution low. This module is also designed to be lightweight and durable, ensuring that it can withstand the rigors of everyday use. It is also designed to be maintenance-free, allowing for easy upkeep and repairs.

The ATS-08F-42-C1-R0 provides an excellent solution for cooling in a wide range of applications. It is designed to provide effective cooling for a variety of systems, from desktop computers to servers and other high-end computing applications. The module is designed to be lightweight and durable, with superior thermal transfer and cooling capabilities. Thanks to its four-channel heat pipe design, this unit is able to provide superior cooling performance while keeping the overall cost of the solution low. As a result, it is an ideal solution for a variety of thermal and power management requirements.

The specific data is subject to PDF, and the above content is for reference

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