ATS-08F-62-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-08F-62-C3-R0-ND

Manufacturer Part#:

ATS-08F-62-C3-R0

Price: $ 3.93
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X15MM L-TAB T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-08F-62-C3-R0 datasheetATS-08F-62-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.57399
30 +: $ 3.37554
50 +: $ 3.17696
100 +: $ 2.97845
250 +: $ 2.77989
500 +: $ 2.58133
1000 +: $ 2.53168
Stock 1000Can Ship Immediately
$ 3.93
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.590" (15.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 16.58°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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Thermal management and heath sinks are important aspects of many electronic devices. ATS-08F-62-C3-R0 is a type of thermal management device used in a variety of applications. This article will explain the application field for this type of heat sink, and also discuss the basic working principle of the device.

Application Field

ATS-08F-62-C3-R0 is a type of thermal management device specifically designed for use in electrical devices where the heat generated needs to be dissipated quickly and efficiently. These thermal management devices can be used in a variety of situations, such as in computers, control systems, and power supplies. The device is also commonly used in industrial applications, such as in motors, pumps, and other high power applications. Additionally, the device can be used in LED lighting systems, where a well-designed heat sink is essential for effective heat dissipation.

Working Principle

The ATS-08F-62-C3-R0 is designed to use convection cooling to dissipate heat. Convection cooling refers to using air as the medium to transfer heat. In the context of thermal management, this means that the heat generated by the device is transferred from the device to the surrounding air. The ATS-08F-62-C3-R0 is designed to be efficient in its heat dissipation, and is designed to optimize air flow to ensure that the hottest air is moved away from the device quickly. To achieve this, the device is made up of an aluminum finned housing. This housing is designed to direct air flow, and enhance the heat dissipation process.

To further optimize the heat dissipation process, the ATS-08F-62-C3-R0 is also fitted with fan blowers. The fan blowers are designed to draw in cool air from the outside environment and blow it over the fins of the device. This helps to ensure that the hottest air is pushed away from the device, and cooler air is blown over the fins. This helps to more efficiently cool the heat sink and reduce temperatures.

In addition to the use of a fan blower, the ATS-08F-62-C3-R0 is also designed with a heatsink riser. This component is typically made of high conductive material such as copper or aluminum, and it sits on top of the heat sink fins. The purpose of this component is to help to draw warmth away from the device, and distribute it evenly over the fins. This helps to reduce overall temperatures, and make the device more efficient in its heat dissipation.

Conclusion

The ATS-08F-62-C3-R0 is a type of thermal management device specifically designed for use in electrical devices. The device uses convection cooling to dissipate heat quickly and efficiently, and it is designed with an aluminum finned housing, fan blowers, and a heatsink riser to optimize the cooling process. This thermal management device is useful for a variety of applications, such as in computers, control systems, power supplies, motors, pumps, and LED lighting systems. With its efficient cooling design, the ATS-08F-62-C3-R0 is a great solution for any thermal management need.

The specific data is subject to PDF, and the above content is for reference

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