| Allicdata Part #: | ATS-08F-75-C3-R0-ND |
| Manufacturer Part#: |
ATS-08F-75-C3-R0 |
| Price: | $ 3.44 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X20MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-08F-75-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.12669 |
| 30 +: | $ 3.04206 |
| 50 +: | $ 2.87305 |
| 100 +: | $ 2.70409 |
| 250 +: | $ 2.53507 |
| 500 +: | $ 2.45056 |
| 1000 +: | $ 2.19705 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.29°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an important factor in the design of electronic components and systems. As electrical components generate and discharge heat, dissipating that heat away from sensitive areas of the circuit prevents overheating of components. Heat sinks are devices used to help dissipate this heat away. The ATS-08F-75-C3-R0 heat sink is a specific type of heat sink designed to aid in the efficient management of heat generated by electronic components and systems.
The ATS-08F-75-C3-R0 is designed for cooling applications in which heat generated from an electronic component or system must be dissipated away via air-cooling methods. The individual fins of the heat sink help dissipate heat away from the component or system, allowing the device to remain cool and running at optimal speeds. The ATS-08F-75-C3-R0 is designed for applications where high temperature removal is needed, such as telecommunications and computer systems, as well as audio electronics systems.
The design of the ATS-08F-75-C3-R0 involves a series of metallic fins that are spaced apart in a specific manner to facilitate air circulation. Each fin is composed of an aluminium alloy material, which helps dissipate the heat generated from the electronics. The fins allow for maximum air circulation, allowing for efficient cooling of the components. The ATS-08F-75-C3-R0 also features a built-in fan system to help increase air circulation and improve cooling efficiency. The fan system is adjustable and can be fine tuned for particular cooling requirements.
The ATS-08F-75-C3-R0 also features an embedded thermal management system, which helps monitor and regulate the temperature of the heat sink. By continuously monitoring the temperature of the heat sink, the thermal management system can continuously adjust the fan speed to maintain optimal cooling. This system also helps reduce noise from the fan system, allowing for quieter operation.
The ATS-08F-75-C3-R0 is a highly efficient and reliable heat sink for applications requiring efficient thermal management. Its thermal management system, adjustable fan speed, and aluminium alloy fins make it an ideal choice for many applications requiring effective cooling. With its lightweight design and space-saving profile, the ATS-08F-75-C3-R0 offers a high level of functionality and reliability. It is an excellent choice for any application where thermal management is of utmost importance.
The specific data is subject to PDF, and the above content is for reference