
Allicdata Part #: | ATS-08F-79-C3-R0-ND |
Manufacturer Part#: |
ATS-08F-79-C3-R0 |
Price: | $ 3.48 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 30X30X10MM R-TAB T412 |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
10 +: | $ 3.16197 |
30 +: | $ 3.07671 |
50 +: | $ 2.90581 |
100 +: | $ 2.73489 |
250 +: | $ 2.56397 |
500 +: | $ 2.47851 |
1000 +: | $ 2.22211 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 1.181" (30.00mm) |
Width: | 1.181" (30.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.394" (10.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 26.55°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
In today’s modern world, Thermal - Heat Sinks have become a necessary component in many industries. The ATS-08F-79-C3-R0 is a thermal-heat sink designed to control and dissipate heat energy generated from various sources. In this article, we will discuss the application field of the ATS-08F-79-C3-R0, as well as how it works and its principle of operation.
The ATS-08F-79-C3-R0 is a highly efficient thermal-heat sink designed for applications that require a high degree of heat transfer and dissipation. The product has a unique design that is suited for a wide variety of applications. It can be used in the automotive industry, computer industry, aerospace industry, industrial equipment, medical equipment, and any other type of machinery where a large amount of electrical or thermal energy needs to be dissipated. It is well suited for cooling off electronics, improving efficiency, and reducing system downtime.
The ATS-08F-79-C3-R0 works by using air or cooling fins to absorb and dissipate the heat generated from various sources. The cooling fins are made up of multiple layers of aluminum and copper that act as heat exchangers. The layer closest to the surface of the component is the most efficient and absorbs most of the heat energy, while the other layers further up the fins act as an additional layer of protection and help dissipate the remaining heat energy. The fins are spaced at an optimal distance from each other to ensure the most efficient heat transfer and cooling.
The ATS-08F-79-C3-R0 also features a thermal-cutoff device to prevent the component from overheating. This safety device will shut off the thermal-heat sink or components if they exceed the prescribed temperature range. It is important to note that the thermal-cutoff device will only function if it is rated for the voltage and current of the component or device that it is attached to.
The ATS-08F-79-C3-R0 uses a combination of air flow and heat exchange mechanisms to optimize the efficiency of its thermal-heat sink. It relies on an intricate network of gas passages, exhaust ducts, and cooling fins to optimize the flow of heat energy from the component. The air flow is directed in a manner that ensures the maximum amount of heat energy is dissipated from the component efficiently. The exhaust ducts are shaped to ensure that the hot air is exhausted out of the system quickly.
The ATS-08F-79-C3-R0 thermal-heat sink is especially useful in applications where high efficiency cooling is needed. It is designed to dissipate the heat energy from components such as microprocessors, CPUs, switches, and other high-powered components quickly and efficiently. The thermal-heat sink is also ideal for LED lighting applications, as the thermal-heat sink is designed to dissipate the heat energy emitted from the LEDs.
In conclusion, the ATS-08F-79-C3-R0 thermal-heat sink is a reliable and efficient product designed for a wide variety of applications. It works by using a combination of air flow and heat exchange mechanisms to transfer and dissipate heat energy from the component quickly and efficiently. The thermal-cutoff device helps to prevent components from overheating and offers an additional layer of protection. The ATS-08F-79-C3-R0 is suitable for applications in the automotive, computer, aerospace, industrial equipment, medical equipment, and other industries where a large amount of electrical or thermal energy needs to be dissipated.
The specific data is subject to PDF, and the above content is for reference