ATS-08F-82-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.181" (30.00mm)
Width:	1.181" (30.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	10.74°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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ATS-08F-82-C1-R0 is a type of thermal heat sink that is suitable for a variety of high temperature applications. It is a finned heat sink that quickly dissipates heat away from the electronic components and into the ambient environment. Its main component is a ridge fin design that helps improve the overall efficiency of the heat sink.In essence, a thermal heat sink is a passive device that is designed to facilitate the transfer of heat from an electronic component or device to its surrounding environment. It works by dissipating thermal energy into the surrounding air, which is known as passive cooling. This process helps to keep the electronic components from overheating and shortening their useful lifespan. They are typically constructed from metal which is designed to draw heat away from the electronic components through conduction.The ATS-08F-82-C1-R0 is designed to reduce the amount of heat created by modern electronics during their use. The heat sink is composed of a rectangular shaped fin which increases the surface area for the effective dissipation of thermal energy. It has an aluminum alloy substrate which provides excellent heat transfer and cooling performance. The thermal heat sink has a flat surface and adjustable mounting points which make it easy to install in various tight spaces. Its overall size is 6.5in x 8in and it is lightweight for easy installation. In terms of performance, the ATS-08F-82-C1-R0 has a thermal resistance of 0.82 K/W and a thermal conductivity of 1.95 W/mk. This makes it well suited for coldplate applications in which high cooling performance is needed. It can also be used in applications that require high power dissipations and where thermal energy needs to be transferred rapidly from the heat source to the environment. Furthermore, the heat sink can be used with other cooling components, such as fans and water coolers, to further improve the efficiency of the cooling system.When using the ATS-08F-82-C1-R0 thermal heat sink, it is important to consider the surrounding environment and the physical constraints of the application. This is to ensure that the airflow is adequate and that there is enough space for the heat sink to make contact with all the components that it needs to cool. Additionally, it is important to use the appropriate heat transfer material to ensure that the thermal energy is transferred efficiently away from the components.In summary, the ATS-08F-82-C1-R0 thermal heat sink is an effective and efficient cooling solution for a variety of high temperature applications. It is well suited for coldplate applications where excellent cooling performance is a necessity. Furthermore, its lightweight and adjustable mounting features make it easy to install in tight spaces. When using the thermal heat sink, it is important to consider the environmental conditions and other physical constraints to ensure a successful cooling system.

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