| Allicdata Part #: | ATS-08F-92-C1-R0-ND |
| Manufacturer Part#: |
ATS-08F-92-C1-R0 |
| Price: | $ 3.48 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X15MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-08F-92-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.16197 |
| 30 +: | $ 3.07671 |
| 50 +: | $ 2.90581 |
| 100 +: | $ 2.73489 |
| 250 +: | $ 2.56397 |
| 500 +: | $ 2.47851 |
| 1000 +: | $ 2.22211 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 16.45°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal solutions such as heat sinks are essential components in many electronic systems. They are used to conduct heat away from the device, helping to maintain optimal operating temperatures and in some cases may even be used to actively cool components. A variety of different technologies are employed in heat sink design, including the ATS-08F-92-C1-R0 heat sink.
The ATS-08F-92-C1-R0 heat sink is designed for applications where high thermal capacity and low profile are required. It is a skived fin heat sink with an overall height of 0.875” and is made from 6063 aluminium. This heat sink houses asymmetrical fin packs, allowing for the maximum cooling capability for its profile. The ATS-08F-92-C1-R0 has an additional 2” fin designed for additional air path, maximizing the contact surface area of the finned section. The combination of the skived fin design and the additional fin makes this a highly efficient and powerful heat sink with a very low profile.
The ATS-08F-92-C1-R0 heat sink works on the natural principle of convection. It conducts heat away from the device and dissipates it into the surrounding environment. The heat sink draws air across its fins which acts as a transfer medium for the heat it is absorbing. This decreases the effective operating temperature of the device and helps to prevent the device from overheating. The increased contact surface area of this heat sink helps to optimize this process and increase its cooling capability.
The ATS-08F-92-C1-R0 heat sink is designed for a variety of applications including industrial, medical, consumer, automotive and aerospace. Due to its low profile, skived fin design and additional fin, it is an ideal solution for applications where maximum cooling capacity is required in a limited space. It is also designed to be rugged and reliable, ensuring it meets the requirements of the most demanding environments. These features make it an ideal cooling solution for a wide range of applications.
In conclusion, the ATS-08F-92-C1-R0 heat sink is a highly efficient, low profile thermal solution making it a great choice for many applications where space constraints are a factor. With its natural principle of convection, it provides an effective means of cooling while its added contact surface area helps to provide maximum cooling capabilities. With its low profile, skived fin design and additional fin, it is an excellent choice for applications which require maximum cooling efficiency in a limited space. The combination of these factors make the ATS-08F-92-C1-R0 heat sink an ideal thermal solution for a wide range of applications.
The specific data is subject to PDF, and the above content is for reference