| Allicdata Part #: | ATS14914-ND |
| Manufacturer Part#: |
ATS-08F-97-C2-R0 |
| Price: | $ 4.33 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-08F-97-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.93750 |
| 10 +: | $ 3.82851 |
| 25 +: | $ 3.61595 |
| 50 +: | $ 3.40326 |
| 100 +: | $ 3.19051 |
| 250 +: | $ 2.97781 |
| 500 +: | $ 2.76511 |
| 1000 +: | $ 2.71193 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 20.30°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The ATS-08F-97-C2-R0 is an industrial grade thermal management component introduced to the market in 2016. It is one of the most advanced heat sinks on the market with its excellent thermal characteristics and superior heat transfer performance.
The ATS-08F-97-C2-R0 is a very cost-effective solution for controlling heat dissipation in a variety of electronic products. It is a flexible and reliable thermal management option that can be used for a wide range of applications. It is also designed to last in the most harsh industrial environments.
The ATS-08F-97-C2-R0’s main feature is its efficient heat sink design, which is based on a combination of thermally conductive and convective features. It consists of two distinct layers: a top layer and a bottom layer. The top layer provides the main cooling mechanism by ensuring good conduction away from the heat source. This layer is composed of an intricate series of finned pin fin construction and offset fins. The bottom layer is made up of a solid surface designed to maximize convective cooling.
The cooling performance of the ATS-08F-97-C2-R0 is further improved by its optimized pin fin design. The fin construction has a larger surface area, allowing for better heat dissipation. The fins are shaped and arranged in such a way to maximize the thermal conductive and convective properties of the heat sink structure. The large fin surface area also helps to dissipate heat over a larger area.
The ATS-08F-97-C2-R0 is most commonly used in the computer and electronic industry for controlling heat dissipation in CPUs, GPUs, ASICs, memory chips, etc. It can also be used in other industries, such as automotive, aerospace, telecommunications, and medical.
In addition to its heat sink capabilities, the ATS-08F-97-C2-R0 can also be used as a fan. This feature provides additional protection against over-heating by directing air over the heatsink fin surface area.
The ATS-08F-97-C2-R0 has been proven to achieve high thermal efficiency and is capable of dissipating large amounts of heat at a low cost. It is a reliable solution for managing electronic products in a variety of industries. The heat sink’s performance, flexibility, and durability make it an ideal choice for thermal management projects.
The specific data is subject to PDF, and the above content is for reference