ATS-08G-10-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-08G-10-C1-R0-ND

Manufacturer Part#:

ATS-08G-10-C1-R0

Price: $ 3.61
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X25MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-08G-10-C1-R0 datasheetATS-08G-10-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.28104
30 +: $ 3.19242
50 +: $ 3.01505
100 +: $ 2.83771
250 +: $ 2.66036
500 +: $ 2.57169
1000 +: $ 2.30565
Stock 1000Can Ship Immediately
$ 3.61
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.87°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management solutions are becoming increasingly important in many industries. ATS-08G-10-C1-R0 is a versatile thermal solution for the electronics industry. This product is a heat sink, which is a passive heat dissipation device. It works by transferring heat away from components and dissipating it into the surrounding air.

The ATS-08G-10-C1-R0 heat sink consists of four main components: a base, a heat conductive material, a fin, and a fan. The base is the foundation of the heat sink and serves as the point of attachment for the fan and other components. The heat conductive material is usually aluminum or copper and is responsible for transferring the generated heat away from the device to the fins. The fins are then responsible for dissipating the heat into the surrounding air.

This heat sink is commonly used for cooling computers and electronic components. Its design ensures that the generated heat from the processor or other components is quickly dissipated. As the heat is removed from the device, it is then replaced with cooler air which helps maintain a consistent temperature. This is essential for protecting the device and keeping it working optimally.

The ATS-08G-10-C1-R0 heat sink also has a number of other features. It has a built-in fan for increased cooling capacity and can also be used for passive cooling in combination with the fins. The fins are designed for maximum surface area to maximize air contact and heat dissipation. Additionally, the heat sink has a reflective surface which helps reduce air drag and further improve cooling efficiency.

This product is a reliable and versatile thermal solution that can be used in a variety of applications. It is easy to install and maintain, making it an ideal choice for the electronics industry. As a heat sink, it provides an effective way to keep the temperature of components and devices at an optimal and safe level.

The specific data is subject to PDF, and the above content is for reference

Latest Products
VHS-45

HEATSINK HALF BRICK ALUM BLACKHeat Sink ...

VHS-45 Allicdata Electronics
MHST15055

HEATSINK 2.36L X1.4"H EXTRUSIONHeat Sink...

MHST15055 Allicdata Electronics
MHST10055

HEATSINK 2.36L X.94"H EXTRUSIONHeat Sink...

MHST10055 Allicdata Electronics
PH3-300-300-0.21-1A

IR HEAT SPREADER/EMITTER W/ADHHeat Sink ...

PH3-300-300-0.21-1A Allicdata Electronics
132-11B9

HEATSINK EXTRUDEDHeat Sink

132-11B9 Allicdata Electronics
413F

HEATSINK POWER TO-3Heat Sink

413F Allicdata Electronics