ATS-08G-10-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-08G-10-C3-R0-ND

Manufacturer Part#:

ATS-08G-10-C3-R0

Price: $ 3.93
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X25MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-08G-10-C3-R0 datasheetATS-08G-10-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.57399
30 +: $ 3.37554
50 +: $ 3.17696
100 +: $ 2.97845
250 +: $ 2.77989
500 +: $ 2.58133
1000 +: $ 2.53168
Stock 1000Can Ship Immediately
$ 3.93
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.99°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The ATS-08G-10-C3-R0 is a high-quality thermal heat sink manufactured by ADVANCED Thermal Solutions, Inc. Designed with an innovative fin array, this heat sink provides excellent thermal performance and long term reliability. The ATS-08G-10-C3-R0 is capable of cooling CPU’s, GPU’s, compact motors, and more. This heat sink can also be used to cool sensitive electronic components.

ATS-08G-10-C3-R0 Features

The ATS-08G-10-C3-R0 includes several features that make it an ideal choice for thermal management applications. This heat sink features a fin array that allows for increased airflows, resulting in improved thermal performance. The fins and base are made from high-grade aluminum, which increases the heat transfer rate and helps to reduce air turbulence. This results in greater heat dissipation than any other material available. Additionally, the ATS-08G-10-C3-R0 features several integrated heat pipes. These heat pipes help to conduct heat away from the components and spread the heat evenly throughout the heat sink, resulting in improved cooling performance.

ATS-08G-10-C3-R0 Application Fields

The ATS-08G-10-C3-R0 is ideal for thermal management applications. It can be used to cool CPU’s, GPU’s, compact motors, sensitive electronic components and more. This heat sink is also a great choice for heat sinks in consumer electronics, gaming consoles, LED lighting systems, high performance computing, and more. It is also commonly used in automotive applications, such as vehicle cooling systems. The ATS-08G-10-C3-R0 is designed to operate in temperatures ranging from -40 to +105 degrees Celsius.

ATS-08G-10-C3-R0 Working Principle

The ATS-08G-10-C3-R0 works by dissipating heat away from the components. The integrated heat pipes conduct heat away from the components and spread the heat evenly throughout the heat sink, resulting in improved cooling performance. As air flows over the fin array, the heat is dissipated from the heat sink, resulting in cooler temperatures. The aluminum used in the fins and base allows for increased heat transfer, resulting in greater heat dissipation.

Conclusion

The ATS-08G-10-C3-R0 is a high-quality thermal heat sink designed to provide excellent thermal management performance. This heat sink is ideal for cooling CPU’s, GPU’s, compact motors, and more. The integrated heat pipes and fin array allow for improved cooling performance, resulting in cooler temperatures. The aluminum fins and base are designed to increase heat transfer, resulting in greater heat dissipation. The ATS-08G-10-C3-R0 is an ideal choice for thermal management applications.

The specific data is subject to PDF, and the above content is for reference

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