ATS-08G-111-C3-R1

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Rectangular, Fins
Length:	2.362" (60.00mm)
Width:	1.575" (40.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.374" (9.50mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	26.82°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

Thermal - Heat Sinks are one of the most commonly used cooling components in a wide range of electronics equipment. As the name suggests, thermal-heat sinks are designed to transfer heat away from components and dissipate it in the atmosphere. In order to do this, they employ a combination of materials, technologies, and processes to transfer heat away from the component to be cooled. One such technology is ATS-08G-111-C3-R1, a Heat Sink designed to provide effective thermal-heat transfer from an appliance to the atmosphere. In this article, we will look at the application field and working principle of ATS-08G-111-C3-R1 Heat Sink.

Application Field of ATS-08G-111-C3-R1 Heat Sink

ATS-08G-111-C3-R1 Heat Sink is a high-end solution designed for cooling components in various sectors, including: • Computers and peripherals: ATS-08G-111-C3-R1 Heat Sink is an ideal solution for cooling components of computer systems, including the CPU, GPU, memory, and hard disk. It is also suitable for cooling controllers and other peripherals such as keyboards and mice. • Automotive electronics: ATS-08G-111-C3-R1 Heat Sinks are able to transfer heat away from automotive components such as engines, brakes, suspension, and other electronic parts. • Industrial electronic: ATS-08G-111-C3-R1 is suitable for industrial applications such as PLCs, servos, CNC machines, and other industrial machines. • Telecommunications and other communication systems: ATS-08G-111-C3-R1 is an ideal solution for cooling components in various communication systems such as digital switching systems, cellular networks, and other radio-frequency communication systems. • Consumer electronics: ATS-08G-111-C3-R1 Heat Sink is also suitable for cooling components in a variety of consumer electronics such as televisions, set-top boxes, home theatre systems, and other electronic home appliances.

Working principle of ATS-08G-111-C3-R1 Heat Sink

ATS-08G-111-C3-R1 Heat Sink is designed to dissipate heat away from the component to be cooled using a number of different thermal-heat conductive materials. It employs a combination of die-cast aluminum and a thin sheet of copper alloy, with a thin layer of insulation placed between them to minimize heat transfer to the atmosphere. The die-cast aluminum provides a large surface area, which creates ideal conditions for thermal-heat transfer to take place. This large surface area is further increased by the use of a copper alloy sheet. The copper alloy sheet also helps to transfer thermal-heat away from the component to be cooled more quickly, as copper is an excellent conductor of heat. The thin layer of insulation between the die-cast aluminum and the copper alloy sheet helps to minimize any heat transfer to the atmosphere, and thus helps to ensure that the component in question is cooled effectively.

Conclusion

ATS-08G-111-C3-R1 Heat Sink is an ideal solution for cooling components in a wide variety of applications, ranging from computers and peripherals, automotive electronics, industrial electronics, telecommunications, and consumer electronics. Its combination of die-cast aluminum and a copper alloy sheet, with a thin layer of insulation in between, makes it an effective heat dissipation solution. Its high-performance design ensures that heat is evenly transferred away from the component to be cooled, and that the component is cooled to the desired level.

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