ATS-08G-16-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	2.126" (54.01mm)
Width:	2.126" (54.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.394" (10.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	18.14°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

Thermal - Heat Sinks are effective devices for dissipating large amounts of heat generated by electrical components. The ATS-08G-16-C3-R0 heat sink is among the most popular types of thermal-heat sinks, and it has a wide variety of applications in the field of electronics cooling. In this article, we will provide a detailed discussion of the application field and working principle of the ATS-08G-16-C3-R0 heat sink.

The Application Field of ATS-08G-16-C3-R0

The ATS-08G-16-C3-R0 heat sink is designed for cooling highly efficient, sensitive, and power-hungry components. This type of heat sink is generally used for processing high-power electric circuits and components, high-powered integrated circuits, and high-speed computing components. As such, it is suitable for application in a variety of fields, including semiconductor electronics, computer hardware, and consumer electronics.In addition, the ATS-08G-16-C3-R0 heat sink can be used in industrial automation, automotive electronics, and power supply devices. It is also used for cooling high-heat emitting components, such as humidifiers, air conditioners, and freezers. Furthermore, it is suitable for radiators that require large heat dissipation areas.

The Working Principle of ATS-08G-16-C3-R0

The ATS-08G-16-C3-R0 heat sink uses an aluminum alloy material as the Thermal-Heat Sink base which is then covered with a heat-dissipating device composed of fan-shaped fins and multiple channels which provide greater airflow and better heat dissipation. The aluminum alloy material also helps to increase thermal conductivity.The heat sink is designed to efficiently absorb heat generated from various electrical components. The combination of the aluminum alloy base and the fan-shaped fins allow the heat sink to absorb the excessive heat generated from the electrical components and, in turn, dissipate it through the fins. The aluminum alloy material also conducts heat effectively, aiding in the dissipation process. In addition, the heat sink features a cooling fan that helps to improve heat dissipation. The cooling fan is designed to draw in cold air that not only helps to cool the heat sink but the electrical components as well. The cooling fan also helps ensure that the temperature of the heat sink and the electrical components remain within acceptable levels.

Conclusion

The ATS-08G-16-C3-R0 heat sink is an effective and efficient device for cooling highly efficient, sensitive, and power-hungry components. It is used in a variety of applications in the fields of semiconductor electronics, computer hardware, consumer electronics, industrial automation, automotive electronics, and power supply devices. The heat sink features an aluminum alloy mixture base which combines with the fan-shaped fins for improved thermal conductivity and heat dissipation. Additionally, the ATS-08G-16-C3-R0 heat sink has a cooling fan for added heat dissipation and cooling.

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