| Allicdata Part #: | ATS15000-ND |
| Manufacturer Part#: |
ATS-08G-167-C2-R0 |
| Price: | $ 3.45 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X20MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-08G-167-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.13740 |
| 10 +: | $ 3.05550 |
| 25 +: | $ 2.97259 |
| 50 +: | $ 2.80753 |
| 100 +: | $ 2.64235 |
| 250 +: | $ 2.47724 |
| 500 +: | $ 2.39466 |
| 1000 +: | $ 2.14693 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.10°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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A thermal heat sink is a piece of equipment designed to reduce heat from an electronic device by dissipating the heat into the ambient air. Most heat sinks are passive components, which means they do not require any external energy source to operate, such as a fan.
The ATS-08G-167-C2-R0 heat sink is a passive device that utilizes aluminum, fins, and a metal clamp to reduce the overall temperature of an electronic device. It has an ambipolar type and the fins of the device are beveled and curved to maximize the surface area. Additionally, the heat sink was constructed with integrated mounting holes for easy installation.
The ATS-08G-167-C2-R0 is typically used in applications such as automotive, medical, aerospace, and consumer electronics. It is suitable for a number of electronic devices with different power levels, including automobiles, industrial machinery, household appliances, and computers.
The device works by transferring heat away from the hot spot of the device which generates the heat, and into the ambient air. The fins on the heat sink are made of a material which has a high heat conductivity. The heat is transferred along the fins toward the cooler air. The fins act as a heat exchanger and allow the heat to be dissipated more efficiently.
The device is designed to work with natural convection (airflow), but can also be used with forced convection (fans) to further increase the device’s cooling efficiency. The fan helps to accelerate the airflow and to increase the rate of heat transfer.
The ATS-08G-167-C2-R0 heat sink is also designed to minimize air resistance and reduce noise caused by the moving fan. The device is low profile, which ensures that its location within the device is not obstructed. Lastly, it has a wide operating temperature range, from -40 to 170 F (or -40 to 77 C).
Overall, the ATS-08G-167-C2-R0 thermal heat sink is an effective way to reduce and dissipate the heat from an electronic device. It has a number of features that make it a suitable choice for a variety of applications, including its low profile, wide temperature range, and ability to operate both passively and with forced convection. The device is a reliable, cost-effective solution for any application that needs efficient heat dissipation.
The specific data is subject to PDF, and the above content is for reference