ATS-08G-177-C2-R0

Thermal management is a the key to the reliability and operation of many electronic and industrial products. Heat sinks are designed to disperse heat away from sensitive components and electronic equipment to promote optimal operating conditions and thermal reliability. One such product is the ATS-08G-177-C2-R0. The application field and working principle of this heat sink will be explored in this article.

Application

The ATS-08G-177-C2-R0 heat sink is commonly used for applications that require cooling of LED chips and integrated circuits. It is also well suited towards multiple fan cooling solutions, and can be used to cool additional components in devices such as laptops and desktops. Additionally, because of its design, the ATS-08G-177-C2-R0 can be implemented in a variety of industries, including automotive, aerospace, and medical. The maximum temperature at which it can be safely used is 85 degrees Celsius.

Design

The ATS-08G-177-C2-R0 is a pin fin heatsink, with an off center mounting hole for fan screw retention. It is composed of aluminum which has been anodized for increased durability and corrosion resistance. The pin fins are asymmetrical to allow for maximum air turbulence, resulting in more efficient heat absorption and dissipation. To further improve its ability to dissipate heat, the fins themselves are serrated and have a concave top surface. It is 178mm in length, 34mm in width, and 27mm in height. Up to 128 of these fins are available.

Working Principle

The ATS-08G-177-C2-R0 utilizes the principle of natural convection, thermal conduction, and radiation to dissipate heat away from stuck components. This heat sink uses natural convection to draw air away from the surface of the heatsink. Thermal conduction takes place directly through the fin materials, dissipating heat away from the stuck component while transferring to ambient air. Radiative cooling takes place when the fin’s surfaces absorb and emit infrared radiation. This radiation is then radiated away from the surface, allowing the heat to be dissipated.

Thermal performance is heavily affected by air flow and the available fins. The higher the air flow over the heatsink, the higher the thermal performance. This is because the air carries away the heat, allowing more of it to be dissipated. Increasing the number of fins improves thermal performance by increasing the heat transfer area between the heatsink and the air. This results in more efficient cooling.

Conclusion

The ATS-08G-177-C2-R0 is a heat sink specifically designed to dissipate heat away from sensitive components. It is widely used in applications in which LED chips and integrated circuits must be cooled and is suitable for a variety of industries. It utilizes natural convection, thermal conduction, and radiation to facilitate efficient heat transfer away from the surface of the heatsink. Air flow over the heat sink and the number of fins affect thermal performance, with higher amounts of air flow and fins resulting in superior thermal performance.