| Allicdata Part #: | ATS-08G-178-C3-R0-ND |
| Manufacturer Part#: |
ATS-08G-178-C3-R0 |
| Price: | $ 3.94 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X25MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-08G-178-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.58596 |
| 30 +: | $ 3.38646 |
| 50 +: | $ 3.18730 |
| 100 +: | $ 2.98809 |
| 250 +: | $ 2.78888 |
| 500 +: | $ 2.58968 |
| 1000 +: | $ 2.53987 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.95°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
ATS-08G-178-C3-R0 is a thermal management device designed to dissipate heat for microelectronic components, such as processors and motors. It includes a thermally conductive aluminum base plate, heat sink fins, a fan, and other components. Generally, when the device is in operation, the fan is able to draw air from the surrounding environment, passing it over the heat sink fins and dissipating heat in the process.
Application Field
As a thermal solution, this device is mainly used in high powered applications that require rapid dissipation of heat. Such applications range from industrial equipment used in factories, such as electric drive motors, to consumer electronics, such as laptop and desktop computers and gaming consoles. ATS-08G-178-C3-R0 is also able to effectively handle heat generated from high-end graphic and video cards. Moreover, this device can also be used for a variety of laboratory and research applications where precise temperature control is required.
Working Principle
The working principle of ATS-08G-178-C3-R0 is based on the laws of thermodynamics. Heat travels from a hotter material to a colder material, and when two materials are in thermal contact, a heat transfer occurs. In the case of this device, heat energy is transferred from the source material (for example, a processor) to the aluminum base plate. The base plate then transfers the heat further to the heat sink fins and finally to the surrounding air.
The heat sink fins increase the area from which the heat energy can be dissipated, and the fan then aids in creating a convective air flow which further assists in heat dissipation. The aluminum base plate is highly thermally conductive, which means that the heat energy is absorbed quickly and efficiently. Moreover, the aluminum base plate also helps to lift the heat sink off the source material, thus improving the overall thermal performance.
Conclusion
ATS-08G-178-C3-R0 is an effective thermal management device, designed to dissipate heat from microelectronic components. It is mainly used in high powered applications that require rapid cooling, such as industrial equipment and consumer electronics, and is also suitable for laboratory and research applications. The device\'s working principle is based on the laws of thermodynamics, and the aluminum base plate helps to increase the surface area from which heat can be dissipated.
The specific data is subject to PDF, and the above content is for reference