| Allicdata Part #: | ATS-08G-35-C2-R0-ND |
| Manufacturer Part#: |
ATS-08G-35-C2-R0 |
| Price: | $ 5.68 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 36.83X57.6X5.84MM T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-08G-35-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.11245 |
| 30 +: | $ 4.82853 |
| 50 +: | $ 4.54444 |
| 100 +: | $ 4.26044 |
| 250 +: | $ 3.97641 |
| 500 +: | $ 3.69238 |
| 1000 +: | $ 3.62137 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 1.450" (36.83mm) |
| Width: | 2.267" (57.60mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.230" (5.84mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 22.48°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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ATS-08G-35-C2-R0 is part of a series of thermal–heat sinks that can be used to dissipate heat coming from a variety of electrical and electronic devices. The thermal–heat sinks are a type of advanced passive device designed to absorb, store, and dissipate thermal energy in order to cool the system or the components within the system. It is typically made of copper, aluminum, steel, or polymers.
The specific model ATS-08G-35-C2-R0 is designed to dissipate heat from high powered electronic components such as processors, controllers, power supplies, or PC boards. It features a fin design which allows for maximum surface area to draw the heat away from the component, and has excellent heat exchange functions.
ATS-08G-35-C2-R0 is made of high-performance ceramic-filled aluminum, which enhances thermal conductivity and increases its effectiveness in thermal dissipation. It has a superior heat dissipation capacity with a maximum temperature rating of 200°C, making it a good choice for high temperature applications.
When considering the choice of a thermal–heat sink for a particular application, it is important to consider the following aspects: size and structure, thermal resistance, power rating, weight, heat transfer rate, and pressure drop performance. For ATS-08G-35-C2-R0, the size and structure are relatively simple and include flat fin construction and standard block height, the thermal resistance is equal to or less than 0.13°C, the power rating is up to 35W, the weight is approximately 1.6kg, the heat transfer rate is 2.35W/cm²°C, and the pressure drop performance is within the normal range.
In order to effectively operate ATS-08G-35-C2-R0, it is necessary to mount it close to the device’s surface to be cooled for maximum heat dissipation. Additionally, airflow is an important factor in whether the thermal–heat sink can effectively dissipate the heat produced by the device. This model is suitable for both natural and forced convection air-cooled systems.
Overall, ATS-08G-35-C2-R0 is an effective and reliable thermal–heat sink for dissipating high heat loads from a variety of electronic components. Its fin design, aluminum construction, and superior thermal conductivity make it a great choice for a wide variety of applications. Additionally, it is relatively easy to install and configure, making it a great choice for anyone looking for a cost-effective solution to their thermal needs.
The specific data is subject to PDF, and the above content is for reference