| Allicdata Part #: | ATS-08H-10-C1-R0-ND |
| Manufacturer Part#: |
ATS-08H-10-C1-R0 |
| Price: | $ 3.61 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-08H-10-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.28104 |
| 30 +: | $ 3.19242 |
| 50 +: | $ 3.01505 |
| 100 +: | $ 2.83771 |
| 250 +: | $ 2.66036 |
| 500 +: | $ 2.57169 |
| 1000 +: | $ 2.30565 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.87°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks help improve the overall efficiency of electrical components, especially those in computers and electronics. One particular device in particular is the ATS-08H-10-C1-R0 heat sink, which has been designed for the specific purpose of dissipating thermal energy from electronic components. This article explores the application field and working principle of this specific thermal heat sink.
The ATS-08H-10-C1-R0 heat sink is designed for use in a broad range of high-power applications. It is typically used in high-end PCs, servers, medical devices, industrial equipment, and many other electronic components in various environments. The device has been designed to be highly efficient at dissipating thermal energy, resulting in longer component life-span and enhanced system performance.
This thermal heat sink is made out of aluminium which is lightweight and easy to manage. It has a black anodized finish which is resistant to corrosion and helps improve dissipative efficiency. The device comes with 8 spring-loaded mounting screws and a single, self-adhesive thermal pad that is applied to the bottom of the heat sink for additional heat absorption.
The main purpose of the heat sink is to draw heat away from its source, allowing the component to remain cool and operating within its safe temperature range. This is achieved by providing an increased surface area which gives more contact area with its environment, resulting in better heat transfer. The ATS-08H-10-C1-R0 heat sink is designed to draw heat away from critical components in a variety of high-power applications at a maximum of 105 degrees Celsius.
The ATS-08H-10-C1-R0 thermal heat sink is an effective solution for those needing to dissipate heat in high-power applications. The heat sink is lightweight, easy to use and comes with a reliable and corrosion-resistant anodized finish. With its optimised cooling properties, large contact areas and spring-loaded mounting screws, it’s easy to see why this device is so popular among tech enthusiasts.
The specific data is subject to PDF, and the above content is for reference