ATS-08H-10-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS15124-ND

Manufacturer Part#:

ATS-08H-10-C2-R0

Price: $ 4.19
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X25MM XCUT T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-08H-10-C2-R0 datasheetATS-08H-10-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 3.80520
10 +: $ 3.70125
25 +: $ 3.49574
50 +: $ 3.29011
100 +: $ 3.08448
250 +: $ 2.87885
500 +: $ 2.67322
1000 +: $ 2.62181
Stock 1000Can Ship Immediately
$ 4.19
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.89°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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THERMAL – HEAT SINKS ATS-08H-10-C2-R0 APPLICATION FIELD AND WORKING PRINCIPLE

Heat Sinks are devices used to keep electric components cool by dissipating excessive heat produced during operation. This relieves stress on the components, reduces the risk of component breakdown, and increases efficiency and performance. ATS-08H-10-C2-R0 Heat Sink is a high-performance thermal heat sink that is ideal for a wide range of applications. Its unique design and superior material allow it to handle more heat load with significantly increased thermal efficiency.

Uses and Applications

ATS-08H-10-C2-R0 Heat Sink is designed for cost-effective thermal management in industrial environments. It features an innovative design that provides excellent heat dissipation for high-power components such as power transistors and integrated circuits. The unique design makes the ATS-08H-10-C2-R0 Heat Sink capable of handling a wide range of temperature and power dissipation levels. It is ideal for cooling high-power components in heating and cooling systems, automotive, industrial, and energy-saving applications.

Design and Material

The design of the ATS-08H-10-C2-R0 Heat Sink is extremely efficient for dissipating heat. It is made of high-grade aluminum alloy to ensure efficient thermal transfer. The extruded aluminum body has internal air channels to further improve heat dissipation and cooling performance. The heat sink features multiple fins with extended surface area for exceptional cooling efficiency. The unique design also allows the heat sink to fit into tight spaces for many applications.

Installation and Maintenance

The ATS-08H-10-C2-R0 Heat Sink is easy to install in both on-site and off-site applications. It comes complete with all the necessary hardware for a secure and reliable connection. The heat sink is designed with a standard mounting plate that allows it to be easily attached to almost any type of surface. No additional tools are needed for installation or maintenance. The heat sink is designed to provide reliable thermal management for the life of the application.

Heat Transfer Performance

The ATS-08H-10-C2-R0 Heat Sink is designed to provide outstanding heat transfer performance. Its high-grade aluminum body makes it highly resistant to excess heat while its internal air channels further enhance heat dissipation. The fins that are spread over the surface area also allow for more efficient heat dissipation. In addition, the unique design makes the heat sink capable of handling a wide range of temperature and power dissipation levels.

Conclusion

The ATS-08H-10-C2-R0 Heat Sink is a high-performance thermal heat sink that is ideal for a wide range of applications. It is made of high-grade aluminum alloy to ensure efficient heat transfer and features multiple fins for superior cooling efficiency. The unique design makes the ATS-08H-10-C2-R0 Heat Sink capable of handling a wide range of temperature and power dissipation levels. It is easy to install and provides excellent heat dissipation for high-power components.

The specific data is subject to PDF, and the above content is for reference

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