| Allicdata Part #: | ATS-08H-115-C1-R0-ND |
| Manufacturer Part#: |
ATS-08H-115-C1-R0 |
| Price: | $ 3.23 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X20MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-08H-115-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.93643 |
| 30 +: | $ 2.85705 |
| 50 +: | $ 2.69829 |
| 100 +: | $ 2.53953 |
| 250 +: | $ 2.38085 |
| 500 +: | $ 2.30148 |
| 1000 +: | $ 2.06339 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.31°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management products play a critical role in the reliability and performance of electronic equipment. Thermal management involves the interpretation and application of heat-related phenomena. ATS-08H-115-C1-R0 is one of the most widely used thermal management products. In this article, we will discuss the application field and working principle of ATS-08H-115-C1-R0.
ATS-08H-115-C1-R0 is a high-performance heat sink. It is a new generation of advanced flat-panel heat sink with superior thermal performance. It can dissipate heat quickly and effectively by increasing the surface area, while maintaining a low profile. It is widely used in industrial control, consumer electronics, telecommunications, computers, and other fields.
The working principle of ATS-08H-115-C1-R0 is quite simple. It uses convection and radiation to dissipate heat efficiently. The heat sink has several deep fin-like protrusions that are designed to take advantage of convection, and the flat surface of the heat sink is designed to radiate heat into the surrounding environment. As the temperature of the surrounding environment increases, more heat is dissipated. This helps reduce the temperature of the device and increases its reliability.
ATS-08H-115-C1-R0 is designed for a variety of applications. It is ideal for applications that require high heat dissipation but need to maintain a low profile. It is especially suitable for consumer electronics, communication devices, and industrial control devices. It is also suitable for applications that require high thermoelectric efficiency, such as power delivery and LED lighting. Additionally, its superior performance makes it suitable for application areas that require high reliability, such as computers and embedded systems.
In conclusion, ATS-08H-115-C1-R0 is a high-performance heat sink with superior thermal performance. Its wide application range and ability to dissipate heat efficiently makes it ideal for a variety of applications. By increasing the surface area, while maintaining a low profile, it is able to effectively dissipate heat. Its convection and radiation properties make it ideal for applications that require high reliability. Overall, ATS-08H-115-C1-R0 is an excellent choice for any thermal management requirement.
The specific data is subject to PDF, and the above content is for reference