ATS-08H-138-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	0.984" (25.00mm)
Width:	0.984" (25.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.590" (15.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	12.46°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks: ATS-08H-138-C3-R0 Application Field and Working Principle

Heat sinks have become an increasingly important key component in a variety of electronic devices over the past few decades. These components are designed to spread and dissipate heat away from critical components, thus helping to maintain their temperature, allowing them to perform better and last longer. One of the more popular kinds of heat sinks is the ATS-08H-138-C3-R0. The ATS-08H-138-C3-R0 is a thermal heatsink manufactured by the Sayorak Corporation. It is a solid aluminum heatsink that is designed for a wide range of applications in both commercial and industrial settings. The ATS-08H-138-C3-R0 has a two-piece aluminum housing that is finished with a high-durability anodizing procedure, ensuring that it will withstand the rigors of tough use in many different environments. It also features a graphite thermal pad and comes in a variety of sizes, allowing it to be used in almost any situation.The ATS-08H-138-C3-R0 is primarily used in the automotive industry and the consumer electronic industry. It can also be found in telecommunications, microwaves, air conditioners, computers, and other areas of technology. The primary purpose of the ATS-08H-138-C3-R0 is to reduce the temperature of the components that make up a circuit board or other electronic device.The ATS-08H-138-C3-R0 works by dissipating heat away from the components through a process of heat transfer. This process works by conducting the heat away from the components through the aluminum housing walls and into the air. In order for this process to be effective, it is important that the heat sink is properly installed on the device carcass or chassis. This ensures that a proper thermal transfer takes place between the components and the heat sink. The ATS-08H-138-C3-R0 also has a graphite thermal pad. This pad helps to ensure that there is an optimal level of thermal conductivity between the heat sink and the components that it is attached to. The graphite thermal pad also helps to reduce the possibility of hot spots forming. Additionally, the graphite provides a thermal barrier preventing heat from escaping back into the device. Overall, the ATS-08H-138-C3-R0 is an effective and reliable thermal heat sink designed for a variety of different applications and environments. Its two-piece aluminum housing and high-durability anodizing procedure ensure that it will be able to provide long-term performance and reliability. Additionally, the graphite thermal pad and wide range of sizes makes it an ideal choice for many different applications. As such, the ATS-08H-138-C3-R0 is an invaluable component in the thermal management of many different electronic devices.

The specific data is subject to PDF, and the above content is for reference