| Allicdata Part #: | ATS-08H-15-C1-R0-ND |
| Manufacturer Part#: |
ATS-08H-15-C1-R0 |
| Price: | $ 3.85 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-08H-15-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.49524 |
| 30 +: | $ 3.40074 |
| 50 +: | $ 3.21174 |
| 100 +: | $ 3.02280 |
| 250 +: | $ 2.83387 |
| 500 +: | $ 2.73940 |
| 1000 +: | $ 2.45602 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.42°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal Management is the core component of modern electronics design and the ATS-08H-15-C1-R0 heat sink is a popular choice for commercial, industrial, and portable electronics designs. The ATS-08H-15-C1-R0 heat sink is part of the Advanced Thermal Solutions, Inc. (ATS) family of thermal-management components and is designed to dissipate heat from electronic components and circuit boards. Here, we will discuss the ATS-08H-15-C1-R0 Heat Sink application field and working principle.
Application Field
The ATS-08H-15-C1-R0 is an aluminum heat-dissipation device with a high-performance copper core which is designed to be used in a variety of applications. It is designed for use in consumer electronics such as laptops, tablets, and smartphones as well as in industrial and medical equipment. The device is also suited for use in high-end audio amplifiers, communication towers, lighting systems and power management systems. Thermally sensitive components, such as CPUs, GPUs and RAM are good applications for this type of heat sink.
Working Principle
Heat rises, so the ATS-08H-15-C1-R0 heat sink disperses heat away from the component, reducing its temperature and therefore allowing it to function efficiently. The principal behind this type of heat sink is that the heat generated by the component transfers into the heat sink, which is then dissipated away from the component by the external air that enters through the device. This works due to the principle of thermal equilibrium, in which two objects come into contact and the temperature of each object will eventually reach an equilibrium.
The ATS-08H-15-C1-R0 heat sink has a copper core with a high thermal conductivity, which allows for greater heat transfer capabilities. It also has a high thermal resistance which helps to reduce the heat generated by the component. The heat sink also features a high surface area which increases its ability to dissipate heat and a built-in fan, which further helps to dissipate heat away from the component. The device also has multiple heat pipes for better heat distribution and dissipation. Finally, the device is lightweight and space-saving, making it an ideal choice for portable electronics and other applications.
Conclusion
The ATS-08H-15-C1-R0 heat sink is a reliable and efficient thermal management component for a wide variety of applications. It gives maximum performance and is designed to dissipate heat from electronic components and circuit boards. Its high thermal conductivity and resistance help to reduce heat transfer, while its light weight and space-saving design make it a great choice for portable electronics. Finally, its multiple heat pipes and built-in fan further enhance its performance and help to dissipate heat away from the component.
The specific data is subject to PDF, and the above content is for reference