| Allicdata Part #: | ATS-08H-166-C3-R0-ND |
| Manufacturer Part#: |
ATS-08H-166-C3-R0 |
| Price: | $ 3.27 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X15MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-08H-166-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.97234 |
| 30 +: | $ 2.89170 |
| 50 +: | $ 2.73105 |
| 100 +: | $ 2.57040 |
| 250 +: | $ 2.40975 |
| 500 +: | $ 2.32942 |
| 1000 +: | $ 2.08845 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.46°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an important consideration for many electronic devices because excessive heat can cause the components within the device to malfunction or even be destroyed. A Heat Sink, such as the ATS-08H-166-C3-R0, is designed to draw heat away from the main components of the device, and disperse it into the surrounding air or environment. This Heat Sink is made up of a combination of aluminum and copper material.
The ATS-08H-166-C3-R0 Heat Sink utilizes the principle of thermal conductivity to effectively move heat away from the main components. The aluminum and copper material of the Heat Sink provides it with a higher thermal conductivity than the main components, allowing it to draw heat away from the components and into the Heat Sink itself. Using a fan in combination with the Heat Sink, the heat is dispersed into the environment.
The ATS-08H-166-C3-R0 Heat Sink is designed to be used in many different types of applications. It is commonly used in high-performance computing systems, where the processor or core components generate a large amount of heat. It is also used in applications such as communication systems, laser systems, LED lighting, servers, and other electronic devices where heat management is an important consideration.
In addition to its use in these various applications, the ATS-08H-166-C3-R0 Heat Sink also has several benefits that make it desirable. For one, its aluminum and copper material provides it with greater thermal conductivity than other Heat Sinks, allowing it to draw more heat away from the components and disperse it more efficiently. Additionally, its design is lightweight and easy to install, meaning that it can be used in a variety of settings.
Overall, the ATS-08H-166-C3-R0 Heat Sink is designed to provide effective thermal management in a variety of applications. It combines the thermal conductivity of aluminum and copper to draw heat away from the main components, and then dissipate it into the air or environment. It is lightweight and easy to install, and is designed to be used in many different types of applications, including high-performance computing, communication systems, laser systems, LED lighting, servers, and other electronic devices.
The specific data is subject to PDF, and the above content is for reference