| Allicdata Part #: | ATS-08H-174-C1-R0-ND |
| Manufacturer Part#: |
ATS-08H-174-C1-R0 |
| Price: | $ 3.70 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X35MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-08H-174-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.36420 |
| 30 +: | $ 3.27348 |
| 50 +: | $ 3.09154 |
| 100 +: | $ 2.90972 |
| 250 +: | $ 2.72785 |
| 500 +: | $ 2.63691 |
| 1000 +: | $ 2.36412 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.98°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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.Thermal management is an important aspect of any modern electrical system, and this is especially true in applications related to electronics, where extreme temperatures can have devastating effects on the performance and longevity of components. Heat sinks are a popular thermal management solution used to keep components within a given temperature range, and the ATS-08H-174-C1-R0 is a particularly useful solution. As can be seen from its name, this particular heat sink is designed to operate at a maximum temperature of 172 degrees Celsius.
The ATS-08H-174-C1-R0 heat sink is composed of two main components: a base and an active area. The base is made from a base material such as aluminum or copper, and this base is designed to dissipate heat away from components. The active area, on the other hand, is made from a material such as high-grade aluminum, which is able to absorb and dissipate more heat than the base material. This combination of materials allows the ATS-08H-174-C1-R0 to operate at temperatures higher than most other heat sinks.
The ATS-08H-174-C1-R0 heat sink is designed to be used in applications that require a high level of thermal management, such as processors, memory modules, and other components that require frequent cooling. The heat sink is also designed to be used in smaller, space-restricted applications, such as handheld electronics. Due to its small size and high thermal performance, the ATS-08H-174-C1-R0 is a popular choice for these kinds of applications.
The ATS-08H-174-C1-R0 heat sink works by using a combination of thermal transfer and air flow. Heat is first dissipated from the active area of the heat sink, and then dissipated into the base material. This heat is then transferred away from the component and dissipated into the surrounding air. The air flow helps to cool the component further, and this process helps to keep the component within its operating temperature range.
The ATS-08H-174-C1-R0 is a highly efficient heat sink, and it is a popular choice for a variety of electronic applications. It is particularly useful for components that require intense thermal management due to its small size and high thermal performance. However, it is important to make sure that the application specifications are met in order to prevent any damage to the components due to overheating.
The specific data is subject to PDF, and the above content is for reference