| Allicdata Part #: | ATS-08H-185-C3-R0-ND |
| Manufacturer Part#: |
ATS-08H-185-C3-R0 |
| Price: | $ 4.32 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X30MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-08H-185-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.88647 |
| 30 +: | $ 3.67059 |
| 50 +: | $ 3.45467 |
| 100 +: | $ 3.23870 |
| 250 +: | $ 3.02279 |
| 500 +: | $ 2.80687 |
| 1000 +: | $ 2.75290 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.45°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-08H-185-C3-R0 is a highly efficient thermal heat sink that works to regulate various temperatures. Designed for extreme conditions, this device is perfect for a range of applications. It works on the principle of heat dissipation through heat dispersal, taking the heat from its source and dispersing it over a larger surface area. By doing so, it helps to keep the temperatures within the required range.
This device has various applications, including regulating the temperatures in computer components and communications systems. It allows for a steady and accurate temperature control for sensitive components. Heat sinks with finer control are ideal for cooling motherboards and other delicate components, protecting them from overheating and subsequent damage. In industrial and medical contexts, stress on sensitive machinery and equipment can be greatly reduced with the addition of ATS-08H-185-C3-R0 heat sinks.
Another application of this device is in the use of industrial 3D printing. The ATS-08H-185-C3-R0 enables fast, efficient, and homogenous cooling in slow and fast printing processes, creating results with less warpage and improved surface finish. It also helps to reduce the temperatures of the running components, giving them a longer lifecycle. Finally, the device can be used to maintain the necessary temperatures for the operation of research instruments and laboratory devices.
The device functions by extracting heat from the plastic extruder during a build. This heat is then transferred to the thermal heat sink and is dissipated over a much larger surface area. The larger surface area helps the heat to more quickly dissipate, allowing it to stay within the required range. By dissipating the heat, the device can maintain temperatures within the specified limits, with accuracy and precision.
Due to its superior performance and reliability, the ATS-08H-185-C3-R0 is becoming increasingly popular in a wide range of applications. It is a highly efficient thermal heat sink that is perfect for extreme conditions. Its superior performance and heat dissipating design make it ideal for cooling motherboards, 3D printing, industrial equipment, research instruments, and other specialized applications. It is one of the most efficient methods for maintaining temperature levels.
The specific data is subject to PDF, and the above content is for reference