ATS-08H-20-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-08H-20-C3-R0-ND

Manufacturer Part#:

ATS-08H-20-C3-R0

Price: $ 4.67
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 54X54X25MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-08H-20-C3-R0 datasheetATS-08H-20-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 4.19895
30 +: $ 3.96543
50 +: $ 3.73225
100 +: $ 3.49896
250 +: $ 3.26570
500 +: $ 3.03243
1000 +: $ 2.97412
Stock 1000Can Ship Immediately
$ 4.67
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.126" (54.01mm)
Width: 2.126" (54.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.21°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management solutions are essential components of a variety of engineered applications. Among these solutions are heat sinks, which draw away heat generated by electronic components and dissipate it into the environment. One such heat sink is the ATS-08H-20-C3-R0, which draws on advanced construction techniques and materials to deliver superior thermal performance. In this article, we will explore the ATS-08H-20-C3-R0\'s applications and working principle.

Applications

The ATS-08H-20-C3-R0 is a high-performance heat sink composed of a single-piece aluminum extrusion with copper spread fins heat dissipation for component cooling. Its T-shaped design and narrow width allows for its use in applications with limited space. Additionally, it uses natural convection and air side heat transfer to cool components while maintaining a low profile.

This heat sink is ideal for applications requiring thermal management of electronics such as power supplies, power amplifiers, motors, and audio equipment. It is suitable for both horizontal and vertical installations, making it an ideal choice for a variety of applications. Additionally, the ATS-08H-20-C3-R0 is compatible with active cooling mechanisms such as fans and blowers.

Working Principle

The ATS-08H-20-C3-R0 utilizes an advanced construction techniques and materials designed for maximum thermal performance. The heat sink is constructed of a single-piece aluminum extrusion combined with a copper base heatsink block and copper spread pins. The aluminum extrusion acts as a primary heat spreader, while the copper base acts as a secondary heat spreader to dissipate the heat away from the component. The copper spread fins and the base heatsink help to further dissipate the heat into the environment.

Heat is transferred from the component to the aluminum extrusion by natural convection. The aluminum extrusion then transfers the heat to the base heatsink. The base heatsink then dissipates the heat away from the component to the environment. Additionally, air side heat transfer is used to help further dissipate heat. The copper spread fins act as a thermal bridge between the base heatsink and the environment, allowing the heat to be dissipated more efficiently.

The ATS-08H-20-C3-R0 is designed to provide superior thermal management for a variety of applications. It utilizes advanced construction techniques and materials to draw away heat from components and dissipate it safely and efficiently into the environment. Its T-shaped design and narrow width makes it an ideal choice for applications with limited space, while air side heat transfer ensures maximum heat dispersion. With its superior performance and convenience, the ATS-08H-20-C3-R0 is an ideal thermal management solution for a variety of applications.

The specific data is subject to PDF, and the above content is for reference

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