| Allicdata Part #: | ATS-08H-32-C2-R0-ND |
| Manufacturer Part#: |
ATS-08H-32-C2-R0 |
| Price: | $ 5.81 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 57.9X36.83X11.43MM T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-08H-32-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.22837 |
| 30 +: | $ 4.93773 |
| 50 +: | $ 4.64726 |
| 100 +: | $ 4.35683 |
| 250 +: | $ 4.06637 |
| 500 +: | $ 3.77592 |
| 1000 +: | $ 3.70330 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.280" (57.90mm) |
| Width: | 1.450" (36.83mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.450" (11.43mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 21.46°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-08H-32-C2-R0 is an industrial-grade heat sink used for dissipating excessive heat from computers, servers, and other electrical components. Designed to be efficient and reliable, this heat sink utilizes an array of fins to provide increased surface area for heat dissipation. The heat is then transferred away from the electrical components via the use of a thermal-conductive material, such as aluminum or copper. This heat is then removed from the device’s environment by the use of a fan or other cooling method.
One of the primary benefits of using the ATS-08H-32-C2-R0 is its low profile design and relatively low cost compared to large-scale cooling solutions. Its simple design and implementation make it a versatile choice for a variety of applications, especially those where space may be a premium. The ATS-08H-32-C2-R0 features a height of only 32mm, making it perfect for components that may not have the room for bulky cooling solutions.
The ATS-08H-32-C2-R0 also features direct contact with the base of the component, making it incredibly efficient at transferring heat away from the component. This direct contact requires a good thermal conductivity material, which can be adjusted depending on the application. For applications requiring greater thermal conductivity, aluminum or copper can be used, while materials such as silicone are better suited for applications where limited heat transfer to the environment is desired.
In addition to dissipating heat, the ATS-08H-32-C2-R0 also helps to reduce noise pollution in the environment. The small size and low-profile design of the heat sink help to keep the fan noise to a minimum. This makes the ATS-08H-32-C2-R0 a great choice for low noise environments such as server rooms and data centers. Additionally, the fanless design eliminates the need for additional power and cooling solutions, which can add to the cost of installation and operation.
Overall, the ATS-08H-32-C2-R0 offers an effective and efficient solution for cooling electrical components. Its small size and low cost make it a great option for many applications, while its direct contact with the base of the component makes it ideal for applications requiring efficient heat transfer. Additionally, the fanless design ensures minimal noise pollution, making it an ideal fit for low noise environments. Thanks to its versatility and efficiency, the ATS-08H-32-C2-R0 is an excellent choice for thermal - heat sinks.
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