ATS-08H-58-C1-R0

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Thermal management is critical for controlling electronic component temperature and protecting devices from heat damage. ATS-08H-58-C1-R0 is a premier thermal heat sink solution to meet the challenge of keeping devices from becoming too hot. Thermal heat sinks enable devices to dissipate heat faster and more efficiently, ultimately increasing performance and durability.

ATS-08H-58-C1-R0 belongs to the RAMFAN thermal heat sink family. It is specially designed to accommodate smaller heat dissipation applications that require a high level of design flexibility. It supports wide temperature range operation and excellent thermal resistance, helping to reduce thermal gradients and manage components effectively.

The ATS-08H-58-C1-R0 heat sink features an aluminum core that is surrounded by fin structures. The fins provide large surface area for heat dissipation. The core and fins are covered with a resilient white epoxy housing that is resistant to common chemicals and wear. The heat sink can also be customized to suit specific application requirements.

The ATS-08H-58-C1-R0 has a working principle that suits multiple applications, such as telecommunications, industrial automation, consumer electronics, and medical devices. It works by convection to transfer heat away from a device, making it a cost-effective and reliable cooling solution. The aluminum core acts as a heat conductor to direct the thermal energy from the device to the fin structures. The fin structures have large surface area that dissipate the heat away from the device.

Due to its high performance, ATS-08H-58-C1-R0 is suitable for a wide range of applications. Its high-performance air distribution and fin design ensures efficient conduction and direct contact between the heat sink and device, making it ideal for liquid and air cooled applications. It can handle up to 200 Watts of power, providing reliable, long-term thermal management.

The ATS-08H-58-C1-R0 heat sink is designed to fit small and compact applications, such as IP cameras, displays, processors, and FPGAs. Its slim design enables easy installation and provides a low-profile package, allowing designers to take advantage of the system’s small size. Furthermore, it has high peak-to-average thermal conduction, so the system is always ready to help maintain device temperature.

Not only does the ATS-08H-58-C1-R0 heat sink provide effective heat management, but it also provides superb design flexibility. Its combination of aluminum core and high surface area fins ensure solid thermal performance in any application. It is designed to fit multiple devices and can be customized according to the customer’s needs. It also supports an extended temperature range and is resistance to dimensional instability.

The ATS-08H-58-C1-R0 thermal heat sink is the ideal solution for managing high power thermal dissipation. Its flexibility enables designers to tailor it to specific applications without sacrificing performance. Its advanced fin structures and resilient epoxy housing make it an effective, reliable, and cost-effective thermal management solution.

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