| Allicdata Part #: | ATS-08H-65-C3-R0-ND |
| Manufacturer Part#: |
ATS-08H-65-C3-R0 |
| Price: | $ 4.61 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X30MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-08H-65-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.15233 |
| 30 +: | $ 3.92175 |
| 50 +: | $ 3.69104 |
| 100 +: | $ 3.46040 |
| 250 +: | $ 3.22971 |
| 500 +: | $ 2.99902 |
| 1000 +: | $ 2.94134 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.40°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal heat sinks are an essential component of many electronic devices, providing effective heat transfer from the component to the external environment. The ATS-08H-65-C3-R0 heat sink is a high performance thermal solution designed to provide efficient and reliable cooling for electronic components with a wide range of applications.
The ATS-08H-65-C3-R0 is designed for both active and passive cooling. It features a large aluminum extruded heat sink which is optimized for maximum heat dissipation. The ATS-08H-65-C3-R0 also includes a built-in fan, which provides additional cooling to ensure that the device runs at optimal temperatures. This fan is also equipped with an adjustable speed control for different speed requirements.
The ATS-08H-65-C3-R0 is compatible with a range of different components. It is suitable for processors, GPUs, memory modules, hard drives, SSDs, motherboards, and other components that require effective cooling. It is also capable of cooling a wide range of electronic devices, from desktops and laptops to servers and data centers.
The ATS-08H-65-C3-R0 utilizes a multi-stage cooling process which combines the heat sink and fan to provide efficient heat transfer. The heat sink acts as a thermal bridge between the component and the fan, providing a direct cooling path for the heat generated by the component. The fan then dissipates the heat from the heat sink, transferring it to the surrounding environment. This two-stage cooling process ensures that the component is cooled efficiently, enabling it to run at optimal performance levels.
The ATS-08H-65-C3-R0 is designed to provide reliable cooling across a range of temperatures. The thermal design is optimized for low temperature operation, and the advanced heat sink technology ensures that the component remains within the specified operating temperatures. The ATS-08H-65-C3-R0 is equipped with an adjustable temperature control system that allows for precise temperature monitoring and control. This ensures that the component remains safe and reliable during operation.
The ATS-08H-65-C3-R0 is designed with quality and durability in mind. Its advanced thermally efficient materials, lightweight construction and robust components make it suitable for long-term reliability and performance. When used with the appropriate components, the ATS-08H-65-C3-R0 provides excellent heat dissipation and electrical insulation properties.
The ATS-08H-65-C3-R0 is a high performance heat sink that is designed to provide efficient and reliable cooling for a wide range of electronic components. It utilizes a multi-stage cooling process that combines the heat sink and fan to effectively transfer heat away from the device. Its lightweight construction, advanced thermally efficient materials and adjustable temperature control system ensure that it is suitable for reliable long-term performance. The ATS-08H-65-C3-R0 is an ideal thermal solution for a variety of applications.
The specific data is subject to PDF, and the above content is for reference