ATS-08H-67-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.394" (10.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	20.30°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction
The ATS-08H-67-C2-R0 is a thermal heat sink manufactured by Advanced Thermal Solutions Inc. (ATS). This heat sink is specifically designed to provide thermal management solutions for LEDs, other light sources, and electronic components in general. Its construction is based on an aluminum extrusion that can be either anodized or powder-coated for better durability and protection against corrosion. The ATS-08H-67-C2-R0 has a low thermal resistance and is highly efficient when it comes to dissipating heat away from the dissipating device. This makes it especially suitable for applications that require high levels of thermal dissipation.

Design Features
The ATS-08H-67-C2-R0 heat sink is designed with a high thermal conductivity, offering a low thermal resistance path for heat dissipation from the dissipating device. This allows for a high rate of thermal dissipation and improved performance of the dissipating device. The construction is also designed to provide excellent heat transfer and dissipate heat quickly and evenly. The design of the heat sink is optimized to reduce any hot spots in the dissipating device, which can lead to premature failure of the dissipating device.

Performance Advantages
One of the major advantages of the ATS-08H-67-C2-R0 heat sink is its high efficiency in dissipating heat away from the dissipating device. This allows for a more efficient operation of the dissipating device, as well as better safety for the device itself. The construction of the ATS-08H-67-C2-R0 also allows for a better air flow in the surrounding environment, allowing for better cooling of the dissipating device. Additionally, the heat sink is designed to reduce any hot spots in the dissipating device, which can cause premature failure of the device. This helps extend the life of the dissipating device as well as improve its performance.

Application Field
The ATS-08H-67-C2-R0 heat sink is designed for applications in a variety of fields. Its sheer size and efficiency make it especially suitable for applications in LED and light fixtures, as well as automotive lighting, computers, communications, and instrumentation. Its low thermal resistance provides reliable thermal management solutions for LED and other electronic light sources. The heat sink can also be used in more demanding applications, such as automotive, military, and aerospace applications. It is also suitable for large-scale devices, such as panel heaters and other large dissipating devices.

Working Principle
The ATS-08H-67-C2-R0 operates on the same basic principles as any other heat sink. It relies upon the ability of the construction material to dissipate heat away from the dissipating device. This is done through thermal conduction, which is the transfer of thermal energy through a solid material. In the case of the ATS-08H-67-C2-R0, the heat is spread out through the construction material, allowing for a low thermal resistance and high efficiency in dissipating heat away from the dissipating device. This helps to ensure that the dissipating device runs at the optimal temperature for performance and safety.

Conclusion
The ATS-08H-67-C2-R0 heat sink is a highly efficient thermal management solution for LED and other light sources, as well as other electronic components. Its construction material is designed to provide excellent heat dissipation, as well as reduced hot spots. This helps to ensure optimal performance and reliability. The ATS-08H-67-C2-R0 is suitable for a wide range of applications, including automotive, military, and aerospace applications. The heat sink also provides reliable thermal management solutions for LED and other light sources, as well as other large dissipating devices.

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