| Allicdata Part #: | ATS-08H-71-C3-R0-ND |
| Manufacturer Part#: |
ATS-08H-71-C3-R0 |
| Price: | $ 4.98 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X30MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-08H-71-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.48812 |
| 30 +: | $ 4.23864 |
| 50 +: | $ 3.98929 |
| 100 +: | $ 3.73993 |
| 250 +: | $ 3.49061 |
| 500 +: | $ 3.24127 |
| 1000 +: | $ 3.17894 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.77°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal Heat Sinks are essential components in a variety of electronic devices. Heat sinks are designed to dissipate heat created by electronic components within a system, preventing components from overheating and ensuring stability of the system. ATS-08H-71-C3-R0 is a special heat sink suitable for applications that require higher levels of passively-cooled thermal performance.
ATS-08H-71-C3-R0 is a low profile heat sink made from high-purity aluminum. The unit is optimized to provide maximum thermal performance with minimal noise, and thanks to its slim design, it is suitable for use in situations where space is at a premium. The heat sink also features an optimized fin geometry with high thermal conductivity, making it an excellent choice for both active and passive cooling solutions.
The working principle of the ATS-08H-71-C3-R0 heat sink is based on a principle of thermal dynamics. Heat is generated by the electronic components within the system and is then dissipated by the heat sink, where it is transferred from the components to the fin structure of the heat sink. From there, the heat is conducted away from the components and dissipated into the air or other cooling medium.
This principle of thermal heat dissipation can be seen in action in many different applications, from small mobile devices to larger servers and computers. The ATS-08H-71-C3-R0 heat sink is particularly suitable for applications which require higher levels of passively-cooled thermal performance. This includes applications such as medical equipment, high-end servers, and PCB enclosures.
The ATS-08H-71-C3-R0 heat sink is designed to offer reliable and efficient thermal performance in-line with the ever-increasing demands of modern electronic applications. The heat sink\'s slim design and optimized fin geometry allow for enhanced heat dissipation, while its low profile offers reliable and stable cooling even under high loads. By making use of such an effective cooling solution, users can ensure their electronic components are safely dissipating heat, avoiding potential issues caused by overheating and ensuring the overall stability of their system.
The specific data is subject to PDF, and the above content is for reference