| Allicdata Part #: | ATS15293-ND |
| Manufacturer Part#: |
ATS-08H-80-C2-R0 |
| Price: | $ 3.72 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-08H-80-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.38310 |
| 10 +: | $ 3.29301 |
| 25 +: | $ 3.20393 |
| 50 +: | $ 3.02602 |
| 100 +: | $ 2.84798 |
| 250 +: | $ 2.67002 |
| 500 +: | $ 2.58101 |
| 1000 +: | $ 2.31400 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 19.03°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are an essential part of many electronic and industrial applications. The ATS-08H-80-C2-R0 is a thermal passives component that is used to help dissipate heat from components in a device. In this article, we will look at the application field and working principle of the ATS-08H-80-C2-R0.
The ATS-08H-80-C2-R0 is a thermal passives component that is specifically designed for applications requiring the transfer of heat from active components to a heat sink. Thermal passives are components that have the ability to dissipate heat without the need for active cooling systems such as fans or pumps. The ATS-08H-80-C2-R0 is a heat sink with an integrated thermal passives and a thermally conductive design. This component is able to transfer heat away from active components by radiative heat transfer from the design of the heat sink.
The ATS-08H-80-C2-R0 is typically used in applications that require efficient heat transfer. This includes applications such as power supplies, CPUs, high-power LEDs, and other electronic devices. The thermal passives on the component allow for efficient heat transfer between the component and the heat sink. In addition, the integrated thermal passives also help to ensure the component does not overheat due to the radiant heat transfer.
The ATS-08H-80-C2-R0 is usually designed for installation on a printed circuit board (PCB) and connected to the components that generate heat. The ATS-08H-80-C2-R0 is installed between the active component and the board. This allows for the heat generated to be dissipated away from the active components. Additionally, the integrated thermal passives on the component also provide additional protection from high temperatures.
In order for the heat sink to work effectively, it is important that the heat generated is dissipated away from the component quickly. The integrated thermal passives on the component help achieve this by efficiently transferring the heat away from the component. This means that the component will remain at a lower temperature than without the thermal passives, and therefore the component can remain operational for longer. The ATS-08H-80-C2-R0 is also able to dissipate heat to the surrounding environment, which helps to keep the temperature of the device lower.
The ATS-08H-80-C2-R0 is an efficient thermal passives component which is suitable for many different applications. The integrated thermal passives on the component help to transfer the heat away from the component and dissipate it to the surrounding environment. The component is able to transfer heat away from active components by radiative heat transfer from the design of the heat sink, making it ideal for applications that require efficient heat transfer. The ATS-08H-80-C2-R0 provides efficient heat transfer and additional protection from over-temperature conditions, making it an ideal choice for applications that require heat transfer.
The specific data is subject to PDF, and the above content is for reference