| Allicdata Part #: | ATS-08H-88-C1-R0-ND |
| Manufacturer Part#: |
ATS-08H-88-C1-R0 |
| Price: | $ 3.56 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X25MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-08H-88-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.23379 |
| 30 +: | $ 3.14622 |
| 50 +: | $ 2.97133 |
| 100 +: | $ 2.79657 |
| 250 +: | $ 2.62181 |
| 500 +: | $ 2.53441 |
| 1000 +: | $ 2.27223 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.08°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an important part of electronics and computer systems. It is important for ensuring efficient operation and minimizing noise and heat. The ATS-08H-88-C1-R0 is a thermal management solution designed to provide high temperature stability and improved heat dissipation properties. This article will discuss the application field and working principle of the ATS-08H-88-C1-R0.
The ATS-08H-88-C1-R0 is a thermal heat sink designed to dissipate heat from electronic components, such as those found in computers or other electronic devices. The thermal heat sink utilizes a combination of aluminum and copper, forming an optimized construction intended to quickly dissipate heat and maintain a stable operating temperature. The thermal heat sink is designed for compatibility with a wide range of electronic components, making it a popular choice for use in applications including consumer electronics, industrial equipment, and automotive systems.
The ATS-08H-88-C1-R0 is designed with a two-layer construction, with an aluminum layer on top and a copper layer on the bottom. The aluminum layer absorbs and dissipates heat from the source, while the copper layer transfers it to the external environment. This provides efficient heat dissipation and lowers the risk of heat buildup in the device. The copper layer is also designed for increased heat accommodation, providing added protection against temperature extremes.
The ATS-08H-88-C1-R0 also features a sophisticated vapor chamber construction, which helps to further improve heat dissipation. The vapor chamber consists of a thin layer of liquid between the aluminum and copper layers, which helps to rapidly spread heat away from the source. The vapor chamber also helps to reduce noise levels, as it prevents the buildup of heat near the source resulting in a quieter operation.
In addition to providing effective heat dissipation, the ATS-08H-88-C1-R0 also offers excellent thermal performance. The aluminum and copper layers are designed to provide optimal thermal properties, while the vapor chamber construction helps to further improve performance. The thermal performance of the ATS-08H-88-C1-R0 is further enhanced by its ability to operate in high-temperature environments.
Overall, the ATS-08H-88-C1-R0 is an effective thermal management solution for a wide range of electronic components. It combines an optimized construction of aluminum and copper layers, combined with a sophisticated vapor chamber design, to provide efficient heat dissipation and improved thermal performance. The ATS-08H-88-C1-R0 is designed for compatibility with a broad range of electronic components, making it suitable for use in consumer electronics, industrial equipment, and automotive systems.
The specific data is subject to PDF, and the above content is for reference