
Allicdata Part #: | ATS15310-ND |
Manufacturer Part#: |
ATS-08H-97-C2-R0 |
Price: | $ 4.33 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 45X45X10MM R-TAB T766 |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
1 +: | $ 3.93750 |
10 +: | $ 3.82851 |
25 +: | $ 3.61595 |
50 +: | $ 3.40326 |
100 +: | $ 3.19051 |
250 +: | $ 2.97781 |
500 +: | $ 2.76511 |
1000 +: | $ 2.71193 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 1.772" (45.00mm) |
Width: | 1.772" (45.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.394" (10.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 20.30°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
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Thermal heat sinks are essential components in various electrical and mechanical systems to transfer heat away from components, such as processors, that generate a large amount of heat during operation. ATS-08H-97-C2-R0 is a thermal-heat sink that was designed with the emphasis on being economical and energy-efficient. This article examines the application field and working principle of ATS-08H-97-C2-R0.
ATS-08H-97-C2-R0 is designed for various commercial, industrial, consumer, and medical applications. It is designed for applications such as LED cooling, power supply cooling, processor cooling, and many others. It is also designed for high-frequency and high-power applications, making it ideal for applications such as lighting and renewable energy solutions. In addition, the heat sink can also be used for cooling applications where air or water is not readily available. It is particularly suited for harsh environments, such as in the automotive and aerospace industries.
ATS-08H-97-C2-R0 employs a unique wavy fins design to maximize heat dissipation. The wavy fin design increases heat sink surface area, allowing for greater heat transfer away from the component being cooled. The fins are also designed to be pressure-resistant, preventing debris or other items from accumulating on the fin surface. The heat sink also has a low profile, making it ideal for applications that have limited space. Finally, the design has an integrated heat spreader that helps to evenly distribute the heat generated by the component.
The working principle of ATS-08H-97-C2-R0 is similar to that of other thermal-heat sinks. When the component is switched on, it will generate heat. To ensure the component does not reach a dangerous temperature, the heat sink is designed to draw the heat away. As the component heats up, the heat sink will become hotter. The heat sink will then have a series of wavy fins that are designed to spread out the heat and promote air flow, allowing the heat to dissipate into the surrounding environment.
In conclusion, ATS-08H-97-C2-R0 is a thermal-heat sink that is designed for various applications and can be used in a variety of environments. It has a wavy fin design that increases the surface area of the heat sink, allowing more heat to be transferred away from the component being cooled. In addition, it has a low profile and is pressure-resistant, making it ideal for applications with limited space. The working principle of the heat sink is similar to that of other thermal-heat sinks, as it will draw the heat away from the component and spread it out into the environment.
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