ATS-09A-05-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS15317-ND

Manufacturer Part#:

ATS-09A-05-C2-R0

Price: $ 3.95
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X25MM XCUT T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-09A-05-C2-R0 datasheetATS-09A-05-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 3.59100
10 +: $ 3.49524
25 +: $ 3.40074
50 +: $ 3.21174
100 +: $ 3.02280
250 +: $ 2.83387
500 +: $ 2.73940
1000 +: $ 2.45602
Stock 1000Can Ship Immediately
$ 3.95
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 8.72°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management technology is essential for modern electronic devices, having a great influence on the performance, efficiency, and life of managing electronic devices. Heat sinks are an important part of thermal management, since they use thermally conductive materials to quickly radiate away heat that builds up inside a device as it is used. The ATS-09A-05-C2-R0 is a high-performance heat sink designed for a wide array of applications.

The ATS-09A-05-C2-R0 is a highly efficient device, designed for use in tougher applications and environments. It is able to handle a wide range of power levels and is rated for as much as 250 watts. Its fins are made of aluminum and are designed with a broad surface area to enable rapid dissipation of the heat it encounters. The base is made of copper, which provides excellent heat conduction, ensuring that the most heat possible is dissipated away. This heat sink is also designed to absorb shock in order to protect the sensitive components onboard the device.

The ATS-09A-05-C2-R0 works using a simple two-stage process to dissipate heat. First, the thermal energy from the device\'s components is conducted through thermally conductive materials, like aluminum and copper, and is transferred to the fins of the heat sink. The fins then radiate the heat away into the environment. The air in the environment serves to cool the fins, helping to lower the temperature. This process allows the heat sink to effectively reduce the temperature within the device, enabling it to perform its tasks without overheating.

The ATS-09A-05-C2-R0 heat sink is designed for a variety of applications, most commonly those that have high levels of power consumption. It is also suitable for industrial applications, due to its shock absorption capabilities. It is a great choice for applications that need to balance performance and cost, since it is both effective in removing heat and relatively inexpensive. The ATS-09A-05-C2-R0 is a great choice for any application that needs an effective way to dissipate heat.

Thermal management is essential for modern electronic devices, and heat sinks are a key component of any thermal management system. The ATS-09A-05-C2-R0 is an excellent choice for many different applications, since it is highly efficient and suitable for a wide range of power levels. It is also inexpensive and designed to protect the device from shock. With its impressive performance and cost, this heat sink is a great choice for anyone looking to improve thermal management in their electronic devices.

The specific data is subject to PDF, and the above content is for reference

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