| Allicdata Part #: | ATS-09A-10-C1-R0-ND |
| Manufacturer Part#: |
ATS-09A-10-C1-R0 |
| Price: | $ 3.61 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09A-10-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.28104 |
| 30 +: | $ 3.19242 |
| 50 +: | $ 3.01505 |
| 100 +: | $ 2.83771 |
| 250 +: | $ 2.66036 |
| 500 +: | $ 2.57169 |
| 1000 +: | $ 2.30565 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.87°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
Thermal - Heat Sinks act as a passive cooling system, involving the transfer of heat from one medium to another by conduction, immersion or radiation. Heat sinks are typically made through processes such as extrusion, die-casting, or stamping and come in a variety of materials such as aluminum, brass, copper, and stainless steel. In electronics, such as CPUs and GPUs, heat sinks are used to efficiently transfer heat away from hot components, allowing them to run cooler and within acceptable temperatures while maintaining optimal performance.
ATS-09A-10-C1-R0 Application Field and Working Principle
The ATS-09A-10-C1-R0 is a low noise, low profile thermal heat sink that is designed to work in diverse applications. This device is made of aluminum alloy, measuring in at 90 x 45 x 10mm and weighs in at 150g. It utilizes both direct contact and forced airflow to dissipate heat more efficiently.
The ATS-09A-10-C1-R0 has a maximum air velocity of 0.2m/sec and works with an airflow of 45~90CFM. It also has an operating temperature range from -15°C to 90°C and a storage temperature range from -20°C to 100°C. The device is very flexible and can be used in a wide variety of applications including transfer molding, heat spreaders, molding systems, heat sinks, and other components.
The ATS-09A-10-C1-R0 utilises direct contact and forced air flow principles to efficiently dissipate heat. Its direct contact option offers increased surface contact with the CPU, GPU, or any other hot devices. Its forced airflow works to quickly pull heat away from the hot device, and disperse it across the transverse heat sink. Both of these principles combine to help maintain components in their most optimal efficiently.
The ATS-09A-10-C1-R0 also offers a high-reliability and stable performance. It features a secure, clip-on structure that reduces the amount of installation time needed. Its high-grade aluminum alloy ensures durability and long-term usage, even in extreme temperatures. As with all heat sinks, it is important to ensure the device is properly installed, with thermal paste or other conductive media to ensure superior heat conduction.
The ATS-09A-10-C1-R0 is a reliable, efficient heat sink that is able to handle a wide range of temperatures. Its clip-on design allows for fast and easy installation, while its high-grade aluminum alloy ensures durability overlong-term usage. The device utilizes both direct contact and forced airflow principles to help manage and dissipate heat more efficiently, allowing for more reliable and optimal performance.
The specific data is subject to PDF, and the above content is for reference