| Allicdata Part #: | ATS-09A-109-C3-R1-ND |
| Manufacturer Part#: |
ATS-09A-109-C3-R1 |
| Price: | $ 5.17 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X40X9.5MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09A-109-C3-R1 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.65003 |
| 30 +: | $ 4.39152 |
| 50 +: | $ 4.13318 |
| 100 +: | $ 3.87488 |
| 250 +: | $ 3.61655 |
| 500 +: | $ 3.35823 |
| 1000 +: | $ 3.29365 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.374" (9.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 27.79°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal-heat sinks are tools specially designed to provide thermal interface with the most efficient cooling. Due to their characteristic low thermal resistance, thermal-heat sinks contribute to cooling widely used components, particularly in the semiconductor industry. One type of thermal-heat sink is the ATS-09A-109-C3-R1. This article will discuss the application field and working principle of the ATS-09A-109-C3-R1.
Application Field
The ATS-09A-109-C3-R1 thermal-heat sink has been specifically designed for use in high-powered components and ICs. Its high thermal conductivity makes it ideal for use in a wide range of applications, such as high-end electronics. It is also easy to install due to its low profile design. These features make it perfect for use in computing, laptops, tablets, and other forms of electronics.
Working Principle
The ATS-09A-109-C3-R1 thermal-heat sink uses a special process for heat transfer. It uses an array of high-performing copper radiators sandwiched between a base plate and a heat sink. The copper radiators are conductive, which provide superior conduction efficiency than other types of radiators. The conduction is further improved when the base plate is connected to a material with a low thermal resistance such as aluminum. The aluminum further acts as a shield for the copper radiators, further improving the thermal efficiency. Furthermore, the copper and aluminum provide excellent thermal convection. The high performance cooling components ensure the device stays cool and working.
The ATS-09A-109-C3-R1 thermal-heat sink is a great choice for those looking for thermal interface of the highest efficiency. Its versatility makes it perfect for a variety of applications, such as computers and high-end electronics. Its low profile design makes it easy to install. Furthermore, its copper and aluminum components provide a low thermal resistance that ensures the highest performance cooling possible.
The specific data is subject to PDF, and the above content is for reference