| Allicdata Part #: | ATS-09A-115-C1-R0-ND |
| Manufacturer Part#: |
ATS-09A-115-C1-R0 |
| Price: | $ 3.23 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X20MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09A-115-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.93643 |
| 30 +: | $ 2.85705 |
| 50 +: | $ 2.69829 |
| 100 +: | $ 2.53953 |
| 250 +: | $ 2.38085 |
| 500 +: | $ 2.30148 |
| 1000 +: | $ 2.06339 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.31°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are essential to managing the temperature of electronic components in systems. A proper heat sink selection can increase a system’s reliability and increase its lifetime. The ATS-09A-115-C1-R0 heat sink is a good choice for many applications due to its high performance. This article will discuss the application field and working principle of the ATS-09A-115-C1-R0 heat sink.
Introduction to the ATS-09A-115-C1-R0 heat sink
The ATS-09A-115-C1-R0 heat sink is designed for use in applications with high heat rejection requirements. It is made from Aluminium and is anodized for improved corrosion protection. It is sized to fit any standard TO-220 package and can be mounted onto either a flat or curved surface. The unique design of the heat sink allows it to evenly distribute heat to a larger surface area than its size, thus reducing the temperature of the component.
Application Field
The ATS-09A-115-C1-R0 heat sink is suitable for many applications including LED lighting, industrial and medical equipment, power electronics, automobile, and communication systems. It is also an ideal choice for applications such as servers, 3D printing, electric vehicles, and industrial automation. This heat sink can handle higher temperatures and higher current loads than many other similar heat sinks.
Working Principle of the Heat Sink
The ATS-09A-115-C1-R0 heat sink has an efficient thermal design. It is designed with multiple fins which help to increase airflow and distribute heat evenly across the entire surface. The fins are also staggered, which allows more air to circulate around the component. This increases heat dissipation and helps to keep the component cool. Additionally, the heat sink is designed with an air-gap, which helps to reduce the temperature of the component further.
Conclusion
The ATS-09A-115-C1-R0 heat sink is an excellent choice for use in applications with high heat rejection requirements. It is designed with multiple fins which help to increase airflow and distribute heat evenly across the entire surface. The unique design of the heat sink allows it to evenly distribute heat to a larger surface area than its size, thus reducing the temperature of the component. The ATS-09A-115-C1-R0 heat sink is suitable for many applications including LED lighting, industrial and medical equipment, power electronics, automobile, and communication systems.
The specific data is subject to PDF, and the above content is for reference