ATS-09A-136-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	2.756" (70.00mm)
Width:	2.756" (70.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	2.22°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

Thermal-heat sinks play an important role in the management of thermal energy, dissipating heat from electronic components to prevent them from becoming too hot and damaging them. The ATS-09A-136-C3-R0 is a higher performance thermal-heat sink relying on passive conduction cooling. It is constructed from aluminum and has a finned design to increase the overall contact surface area, allowing heat to dissipate more quickly from the heat generating source.

Construction

The ATS-09A-136-C3-R0 is made from aluminum alloy, giving it high thermal conductivity and a lightweight construction. The components are machined in-house on accurate CNC machining centers, attached together with screws. The surfaces of the finned structure are then deburred and thoroughly cleaned before being anodized for corrosion protection. The ATS-09A-136-C3-R0 has a finned design, which increases the contact surface area of the thermal sink. The fins are made from a combination of aluminum and copper, allowing them to transfer thermal energy from the component to the sink. The fins are connected to the top surface of the sink with copper heat pipes to provide efficient heat transfer between the two components.

Design Features

The ATS-09A-136-C3-R0 is designed to perform under harsh conditions. The top of the heat sink is made from a flat aluminum plate, making it an ideal platform for mounting components. The shape of the fins is designed to optimize air flow and increase the thermal efficiency of the heat sink.The ATS-09A-136-C3-R0 is designed to operate in environments with high temperatures. It is constructed with a heat spreader plate, which helps to keep the top of the heat sink from becoming too hot. The fins are also designed to help improve heat transfer and dissipate heat away from the component.

Application and Working Principle

The ATS-09A-136-C3-R0 is suitable for various types of applications. It is often used in computers, home electronics, and industrial equipment. It can also be used in compact, high power applications such as automotive and aerospace.The working principle of the ATS-09A-136-C3-R0 is to dissipate heat from the component to the thermal-heat sink. This is done using passive conduction cooling, where thermal energy is transferred between the component and the sink. Heat energy is absorbed by the thermal-heat sink and out to the environment. This increases the surface area of contact between the component and the heat sink, allowing for increased heat transfer and better cooling. The ATS-09A-136-C3-R0 is designed to be reliable and efficient. It also requires low maintenance and is resistant to corrosion. This makes it ideal for a wide range of applications and environments.

Conclusion

The ATS-09A-136-C3-R0 is a high performance thermal-heat sink that relies on passive conduction cooling. It is constructed from aluminum and has a finned design to increase the overall contact surface area, allowing heat to dissipate more quickly from the heat generating source. It is suitable for various types of applications, including computers, home electronics, and industrial equipment. It is designed to be reliable and efficient and requires low maintenance and is resistant to corrosion.

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