ATS-09A-141-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-09A-141-C1-R0-ND

Manufacturer Part#:

ATS-09A-141-C1-R0

Price: $ 3.27
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 30X30X10MM L-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-09A-141-C1-R0 datasheetATS-09A-141-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 2.97234
30 +: $ 2.89170
50 +: $ 2.73105
100 +: $ 2.57040
250 +: $ 2.40975
500 +: $ 2.32942
1000 +: $ 2.08845
Stock 1000Can Ship Immediately
$ 3.27
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.181" (30.00mm)
Width: 1.181" (30.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 15.66°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is essential for the successful operation of most electronics. Heat sinks are thermal components that reduce temperature by dispersing heat away from a surface to the environment. The ATS-09A-141-C1-R0 is a compact, high-performance heat sink that is widely used in industrial and commercial applications.

The ATS-09A-141-C1-R0 is designed for use in extreme temperature environments. It is made from an aluminum alloy with an epoxy finish for maximum durability and corrosion resistance. The heat sink is designed with a high-efficiency, lightweight thermal design that maximizes thermal performance and prevents hot spots. The surface of the heat sink is designed to maximize airflow in order to improve cooling and reduce heat loads.

The ATS-09A-141-C1-R0 utilizes a combination of thermal conduction and convection to transfer heat away from a device. The heat sink has a large surface area that increases contact with the air so that more heat can be dispersed from the surface of the device. The heat sink features fins on the top and sides and is designed to take advantage of natural convection currents to maximize heat transfer. The fins are designed to be vertically oriented so that the heat can move up and away from the device and be quickly dissipated.

The ATS-09A-141-C1-R0 has a simple but effective installation process and requires little effort in terms of maintenance. The heat sink can be installed using standard thermal tapes or other fastening methods. It is designed to be lightweight and easy to install, making it ideal for both commercial and industrial applications.

The ATS-09A-141-C1-R0 is a versatile heat sink that can be used in a variety of applications. It is designed to dissipate the heat generated by a device, preventing overheating and system failure. The heat sink is designed to optimize thermal performance and reduce operating temperatures in high-temperature environments. It is an ideal solution for industrial, commercial, and automotive applications.

The specific data is subject to PDF, and the above content is for reference

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