| Allicdata Part #: | ATS15369-ND |
| Manufacturer Part#: |
ATS-09A-142-C2-R0 |
| Price: | $ 3.84 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09A-142-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.49020 |
| 10 +: | $ 3.40011 |
| 25 +: | $ 3.30800 |
| 50 +: | $ 3.12430 |
| 100 +: | $ 2.94052 |
| 250 +: | $ 2.75675 |
| 500 +: | $ 2.66487 |
| 1000 +: | $ 2.38918 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.07°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are an essential component of many thermal designs. A heat sink is a passive component in a device that transfers heat generated by the device to the surrounding environment. High performance heat sinks are designed to operate with maximum efficiency and minimal noise, while offering flexibility in terms of both cooling capacity and design. The ATS-09A-142-C2-R0 is a well-designed heat sink made from aluminum that has been optimized for high performance.
ATS-09A-142-C2-R0 Features
The ATS-09A-142-C2-R0 heat sink is an extrusion aluminum heat sink that is designed for use in electronics cooling applications. It is constructed from high performance aluminum alloy with a lightweight design that offers superior thermal conductivity and heat dissipation. The ATS-09A-142-C2-R0 features an optimized fin design that maximizes surface contact and cooling efficiency. It offers a maximum cooling capacity of 6.00 W/K, a maximum thermal resistance of 0.30 C/W, and a maximum fan airflow of 250 CFM. The heat sink also features a clean and sleek appearance with a low profile design that is ideal for applications with limited space.
ATS-09A-142-C2-R0 Application Field and Working Principle
The ATS-09A-142-C2-R0 is a versatile heat sink suitable for a variety of thermal applications. It is commonly used in high power, electronics cooling applications such as in LED lighting, power supplies, data storage systems, motor control equipment, computer systems, and high-end consumer equipment. The ATS-09A-142-C2-R0 is also suitable for a variety of industrial applications such as telecommunication systems, temperature monitoring systems, automation, power conversion, and automation systems.
The ATS-09A-142-C2-R0 working principle is based on the fact that heat needs to be dissipated away from the area of high temperatures in order to maintain optimum operating conditions for the system. The heat sink is designed to draw the generated heat away from the sensitive electronic components and transfer it into the atmosphere through a process of thermal conduction. The fins of the heat sink serve to increase the surface area that comes into contact with the air molecules, as air is an excellent insulator due to its poor thermal conductivity. This increases the rate of heat transfer from the hot source, such as an electronic component, to the outside environment. The fan also helps to increase the rate of heat transfer by providing additional airflow around the heat sink and dispersing the hot air away from the heat source.
Conclusion
The ATS-09A-142-C2-R0 is a high performance heat sink designed to provide maximum cooling performance while offering a sleek design that is perfect for high power electronics cooling applications. The ATS-09A-142-C2-R0 features an extruded aluminum construction with an optimized fin design that provides superior thermal conductivity and heat dissipation. Its lightweight design, high cooling capacity, and low profile make it ideal for a variety of applications. Furthermore, its working principle is based on the process of thermal conduction, in which the heat sink extracts the generated heat away from sensitive electronic components and transfers it to the atmosphere via air molecules.
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