ATS-09A-18-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-09A-18-C3-R0-ND

Manufacturer Part#:

ATS-09A-18-C3-R0

Price: $ 4.33
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 54X54X15MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-09A-18-C3-R0 datasheetATS-09A-18-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.89781
30 +: $ 3.68151
50 +: $ 3.46487
100 +: $ 3.24834
250 +: $ 3.03178
500 +: $ 2.81523
1000 +: $ 2.76109
Stock 1000Can Ship Immediately
$ 4.33
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.126" (54.01mm)
Width: 2.126" (54.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.590" (15.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 13.45°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Overview

ATS-09A-18-C3-R0 is a Thermal - Heat Sink from Ackworth Technologies. This type of heat sink is used to reduce the temperature of various components to ensure their reliability and performance. By dissipating excess heat away from these components, the products are able to function as they were designed to.

Application field

The ATS-09A-18-C3-R0 Thermal - Heat Sink is used in applications requiring thermal management of electronics and components such as CPUs, APUs, GPUs, heatsinks, fans, LED drivers, power converters, detectors, and other electronic devices. It can be used to cool components that generate a considerable amount of heat during operation, such as those found in data centers, medical equipment, and industrial systems.

Working Principle

The ATS-09A-18-C3-R0 Thermal - Heat Sink works by transferring excess heat from the component’s surface into the ambient air. This is achieved by the presence of fins, which allow more air to come in contact with the component’s surface. The fins also work to increase the area for heat exchange between the component’s surface and the surrounding air, increasing the rate at which heat is dissipated. The fins also increase turbulence of the air, which also enhances the rate of heat exchange. In addition, the ATS-09A-18-C3-R0 can also be designed with an effective internal air flow pattern, improving the evenness of the temperatures across the heat sinked component.

Advantages

The ATS-09A-18-C3-R0 Thermal - Heat Sink has a number of advantages. It is lightweight, highly efficient, and easy to install. It has an effective thermal resistance and works well with various processor designs. It also features a fanless heatsink solution, which eliminates the need for a cooling fan. The design also allows for a wide range of mounting positions, making it versatile for a number of different applications.

Conclusion

The ATS-09A-18-C3-R0 Thermal - Heat Sink from Ackworth Technologies is a great solution for cooling components in data centers, medical equipment, and industrial systems. It is lightweight, highly efficient, and easy to install, and can be used in various processor designs. With its fanless heatsink solution and wide range of mounting positions, this heat sink can handle a variety of applications.

The specific data is subject to PDF, and the above content is for reference

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